TM-650 2.4.41.2A-2004

Coefficient of Thermal Expansion-Strain Gage Method

TM-650 2.4.41.2A-2004 发布历史

To describe the strain gage method for determining linear thermal expansion of laminated materials within the temperature range of ?55 ??to +130 ??and inorganic substrates (nonlaminated) with a range of ?55 ??to +150 ?? Care should be taken if the higher temperatures are used. The adhesive shown is rated by the manufacturer from less than ?200 ??to greater than +300 ?? however@ for higher temperature pretesting with the Titanium Silicate Standard or materials of known thermal expansion characteristics is recommended.

TM-650 2.4.41.2A-2004由IPC - Association Connecting Electronics Industries 发布于 2004-05-01，并于 2005-06-23 实施。

TM-650 2.4.41.2A-2004的历代版本如下：

• 2004年05月01日 TM-650 2.4.41.2A-2004

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标准号

TM-650 2.4.41.2A-2004

发布日期

2004年05月01日

实施日期

2005年06月23日

废止日期

无

中国标准分类号

/

国际标准分类号

/

发布单位

IPC - Association Connecting Electronics Industries

引用标准

4

适用范围

To describe the strain gage method for determining linear thermal expansion of laminated materials within the temperature range of ?55 ??to +130 ??and inorganic substrates (nonlaminated) with a range of ?55 ??to +150 ?? Care should be taken if the higher temperatures are used. The adhesive shown is rated by the manufacturer from less than ?200 ??to greater than +300 ?? however@ for higher temperature pretesting with the Titanium Silicate Standard or materials of known thermal expansion characteristics is recommended.