EN 61189-5-4:2015 电气材料、印制板和其他互连结构和组件的测试方法 第 5-4 部分：材料和组件的通用测试方法 用于印制板组件的焊料合金和助焊剂和非助焊剂实心焊丝
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on ...