GSO IEC 61188-5-5:2014

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

GSO IEC 61188-5-5:2014 发布历史

GSO IEC 61188-5-5:2014由GSO 发布于 2014-12-25。

GSO IEC 61188-5-5:2014在国际标准分类中归属于: 31.180 印制电路和印制电路板。

GSO IEC 61188-5-5:2014 的最新版本是哪一版？

最新版本是 GSO IEC 61188-5-5:2014 。

GSO IEC 61188-5-5:2014的历代版本如下：

• 2014年 GSO IEC 61188-5-5:2014

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design and the land pattern dimensions. The land pattern dimensions are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board. The existing models create a platform that is capable of establishing a reliable solder alloy used to make that joint (lead-free, tin lead, etc.). Process requirements for solder reflow are different based on the solder alloy and should be analyzed in order that the process is above that temperature a sufficient time to form a reliable metallurgical bond.

标准号

GSO IEC 61188-5-5:2014

发布

2014年

发布单位

GSO

当前最新

GSO IEC 61188-5-5:2014

 

 

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