GSO IEC 62137-1-5:2013
表面贴装技术 表面贴装焊接接头的耐久性和环境试验方法 零件编号（1-5）：机械剪切应力试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

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标准号

GSO IEC 62137-1-5:2013

发布

2013年

发布单位

GSO

当前最新

GSO IEC 62137-1-5:2013

 

 

适用范围

IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (for example solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

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