61191-2-2013 Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies (Edition 2.0)
Ensembles de cartes imprimées – Partie 2: Spécification intermédiaire – Exigences relatives à l’assemblage par brasage pour montage en surface (Edition 2.0)
This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. throughhole@ chip mounting@ terminal mounting@ etc.).