EN 60749-20-1:2009 半导体器件 机械和气候测试方法 第 20-1 部分：对水分和焊接热的综合影响敏感的表面贴装器件的处理、包装、标签和运输
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
IEC 60749-20-1:2009 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air. The purpose of this document i...