EN 61760-3:2010

Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering

EN 61760-3:2010 发布历史

IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.

EN 61760-3:2010由欧洲电工标准化委员会 IX-CENELEC 发布于 2010-04-23，并于 2010-07-01 (7) 实施，于 2013-04-01 (7) 废止。

EN 61760-3:2010在国际标准分类中归属于: 31.190 电子元器件组件。

EN 61760-3:2010的历代版本如下：

• 2010年 EN 61760-3:2010

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标准号

EN 61760-3:2010

发布

2010年

发布单位

欧洲电工标准化委员会

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EN 61760-3:2010

 

 

适用范围

IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.

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