BS 7822-3-1995
低压系统设备的绝缘配合.第3部分:印制电路板组件为达到绝缘配合的涂层使用
Insulation coordination for equipment within low-voltage systems - Use of coatings to achieve insulation coordination of printed board assemblies
BS 7822-3-1995 中，可能用到以下仪器设备
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- 标准号
- BS 7822-3-1995
- 发布日期
- 1995年11月15日
- 实施日期
- 1995年11月15日
- 废止日期
- 无
- 中国标准分类号
- L30;K60
- 国际标准分类号
- 29.080.01
- 发布单位
- GB-BSI
- 被代替标准
- 88/22388 DC-1988
- 适用范围
- This part of IEC 664 applies to rigid printed board assemblies with an insulating coating applied to one or both sides of the printed board. Such coatings are used to provide insulation and to protect the microenvironment of the printed board assembly surface against pollution, for the purpose of insulation coordination. It describes the requirements and test procedures for printed board assemblies provided with coatings. This part covers two types of coatings: - type A coating only provides protection against pollution. The clearance and creepage distance requirements of IEC 664-1 apply to the printed board assembly under the coating; - type B coating provides protection against pollution and insulation. There are no requirements for clearances and creepage distances under the coating. Only the requirements of IEC 664-1 for solid insulation apply. NOTES 1 For type B coating, the conductors are embedded in solid insulation consisting of the base material and the coating. 2 Clearances and creepage distance requirements apply to all uncoated parts of the board and between conductive parts over the coating. The principles in this part are applicable to functional and basic insulation. Note 3 - For supplementary and reinforced insulation, additional requirements, which are under consideration, may apply.