IEC 61188-1-1-1997
印制电路板和印制电路板组件 设计和使用 第1-1部分:一般要求 电子组件的平整度情况

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

IEC 61188-1-1-1997 发布历史

This part of IEC 61188 describes those factors which control the flatness of rigid printed boards and their assemblies. The object of this standard is to inform the designer, manufacturer, assembler and user of rigid printed boards and their assemblies about those factors affecting their flatness. This standard incorporates advice regarding: - design (clause 3); - base material (clause 4); - unassembled printed boards (clause 5); - printed board assemblies (clause 6).

IEC 61188-1-1-1997由国际电工委员会 IX-IEC 发布于 1997-08。

IEC 61188-1-1-1997 在中国标准分类中归属于: L30 印制电路，在国际标准分类中归属于: 31.190 电子元器件组件。

IEC 61188-1-1-1997的历代版本如下：

• 1997年08月 IEC 61188-1-1-1997 印制电路板和印制电路板组件 设计和使用 第1-1部分:一般要求 电子组件的平整度情况

标准号

IEC 61188-1-1-1997

发布日期

1997年08月

实施日期

废止日期

无

中国标准分类号

L30

国际标准分类号

31.190

发布单位

IX-IEC

被代替标准

IEC 52/721/FDIS-1997

适用范围

This part of IEC 61188 describes those factors which control the flatness of rigid printed boards and their assemblies. The object of this standard is to inform the designer, manufacturer, assembler and user of rigid printed boards and their assemblies about those factors affecting their flatness. This standard incorporates advice regarding: - design (clause 3); - base material (clause 4); - unassembled printed boards (clause 5); - printed board assemblies (clause 6).

IEC 61188-1-1-1997系列标准

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