IEC 60300-3-7:1999
可信性管理 第3-7部分:应用指南 电子硬件可靠性应力筛选

Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware

作废

IEC 60300-3-7:1999 发布历史

This part of IEC 60300 serves as an application guide to a reliability stress screening process for electronic hardware. The concept, purpose and justification of the screening process are explained. The main elements of a screening programme are stated, together with the general planning procedure. This standard is intended as a guide and should be used in conjunction with one of the IEC reliability stress screening standards, ("tools" in the toolbox concept), referenced in clause 15, based on the screening process application level. This standard gives guidance in cases where it is essential that early failures be removed from the items manufactured in order to deliver them to the customer when the problems causing the early failures are solved. The standard also gives guidance on where the reliability stress screening should be carried out, i.e. component level, subsystem level, or system level (see figure 1), and can also be used where steps to reduce the risk of early failures are included in a contract. This standard is aimed at personnel in the contract department, project management, product development, process management, production, quality control and purchasing.

IEC 60300-3-7:1999由国际电工委员会 IX-IEC 发布于 1999-05，并于 2007-07-27 实施。

IEC 60300-3-7:1999 在中国标准分类中归属于: L05 可靠性和可维护性。

IEC 60300-3-7:1999的历代版本如下：

• 1999年 IEC 60300-3-7:1999 可信性管理 第3-7部分:应用指南 电子硬件可靠性应力筛选

IEC 60300-3-7:1999 可信性管理 第3-7部分:应用指南 电子硬件可靠性应力筛选 于 1998-11 变更为 IEC 61163-2:1998 可靠性应力筛选 第2部分:电子元器件。

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标准号

IEC 60300-3-7:1999

发布

1999年

发布单位

国际电工委员会

 

 

代替标准

IEC 61163-2:1998

适用范围

This part of IEC 60300 serves as an application guide to a reliability stress screening process for electronic hardware. The concept, purpose and justification of the screening process are explained. The main elements of a screening programme are stated, together with the general planning procedure. This standard is intended as a guide and should be used in conjunction with one of the IEC reliability stress screening standards, ("tools" in the toolbox concept), referenced in clause 15, based on the screening process application level. This standard gives guidance in cases where it is essential that early failures be removed from the items manufactured in order to deliver them to the customer when the problems causing the early failures are solved. The standard also gives guidance on where the reliability stress screening should be carried out, i.e. component level, subsystem level, or system level (see figure 1), and can also be used where steps to reduce the risk of early failures are included in a contract. This standard is aimed at personnel in the contract department, project management, product development, process management, production, quality control and purchasing.

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