This part of IEC 60749 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. NOTE It is recommended that the moisture absorption parameters used in this standard be obtained from the material suppliers (such as the resin supplier).
IEC 60749-39-2006由国际电工委员会 IX-IEC 发布于 2006-07。
IEC 60749-39-2006 在中国标准分类中归属于: L40 半导体分立器件综合,在国际标准分类中归属于: 31.240 电子设备用机械构件。
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