This part of IEC 60749 describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages. In general, this mechanical shock test is in conformity with IEC 60068-2-27 but, due to specific requirements of semiconductors, the clauses of this standard apply.
IEC 60749-10-2002由国际电工委员会 IX-IEC 发布于 2002-04。
IEC 60749-10-2002 在中国标准分类中归属于: L40 半导体分立器件综合,在国际标准分类中归属于: 31.080.01 半导体器分立件综合。
IEC 60749-10-2002 半导体器件.机械和气候试验方法.第10部分: 机械振动 由 IEC 60749-1996 变更而来。
IEC 60749-10-2002 半导体器件.机械和气候试验方法.第10部分: 机械振动 由 IEC 60749 AMD 1-2000 变更而来。
IEC 60749-10-2002 半导体器件.机械和气候试验方法.第10部分: 机械振动 由 IEC 60749 AMD 2-2001 变更而来。
IEC 60749-10-2002 半导体器件.机械和气候试验方法.第10部分: 机械振动 由 IEC 60749 Edition 2.2-2002 变更而来。
IEC 60749-10-2002 半导体器件.机械和气候试验方法.第10部分: 机械振动 由 IEC/PAS 62186-2000 变更而来。
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