This part of IEC 62258 has been developed to facilitate the production, supply and use of
semiconductor die products, including
? wafers;
? singulated bare die;
? die and wafers with attached connection structures;
? minimally or partially encapsulated die and wafers.
This technical report contains a questionnaire, based on the requirements of other parts of IEC
62258, which may be used in negotiations and contracts between suppliers and purchasers of
die devices. It is intended to assist all those involved in the supply chain for die devices to
comply with the requirements of the IEC 62258-1 and IEC 62258-2 standards.
It should be recognized that the tables contained in this technical report form a checklist of
information that can potentially be supplied and that it may not be relevant or possible to
complete all fields. Different markets may require different subsets of the information
requested herein.