JEDEC JESD22-B113-2006
手持电子产品元件互联可靠性特征的桌子高度交变弯曲测试方法

Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products

作废

JEDEC JESD22-B113-2006 发布历史

JEDEC JESD22-B113-2006由(美国)固态技术协会,隶属EIA US-JEDEC 发布于 2006-03-01。

JEDEC JESD22-B113-2006 在中国标准分类中归属于: L40 半导体分立器件综合，在国际标准分类中归属于: 31.080 半导体分立器件。

The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of surface mount electronic components in an accelerated test environment for handheld electronic products applications. The purpose is to standardize the test methodology to provide a reproducible performance assessment of surface mounted components while duplicating the failure modes normally observed during product level test. This is not a component qualification test and is not meant to replace any product level test that may be needed to qualify a specific product and assembly.

标准号

JEDEC JESD22-B113-2006

发布

2006年

发布单位

(美国)固态技术协会,隶属EIA

 

 

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