IPC D-330 SECTION 8-1992由美国电子电路和电子互连行业协会 US-IPC 发布于 1992-01-01。
IPC D-330 SECTION 8-1992 在中国标准分类中归属于: L10 电子元件综合,在国际标准分类中归属于: 31.190 电子元器件组件。
Hybrid microelectronics and the use of ceramic printed boards represent viable approaches to electronic circuit packaging. As the term "hybrid" implies, this approach encompasses multiple technical disciplines which sometimes require compromises among process flow, component selection, and final package configuration. The purpose of this chapter is to present an overview of the hybrid microcircuit design procedure, to assist the design activity in the early identification of such compromises, as mentioned above, and to permit the selection of design and process alternatives that will emphasize the inherent advantages of this packaging technology.
抢抓全球5G和工业互联网契机,围绕5G网络、工业互联网和数据中心建设,重点推进射频阻容元件、中高频元器件、特种印制电路板、高速传输线缆及连接组件、光通信器件等影响通信设备高速传输的电子元器件应用。新能源汽车和智能网联汽车市场。...
本标准适用于仪器仪表行业各类印制电路板的老化筛选。JB/T 6174-19922021-07-014 JB/T 7489-2020仪器仪表印制电路板组装件修焊工艺规范 本标准规定了仪器仪表印制电路板组装件修焊作业的工艺条件、修焊范围和修焊方法。 本标准适用于仪器仪表印制电路板组装件的修焊,其他行业印制板组装件的修焊亦可参照执行。...
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