IPC D-330 SECTION 8-1992
第8章混合微电路和陶瓷印制电路板组件

Section Eight Hybrid Microcircuit and Ceramic Printed Board Assemblies


IPC D-330 SECTION 8-1992 发布历史

IPC D-330 SECTION 8-1992由美国电子电路和电子互连行业协会 US-IPC 发布于 1992-01-01。

IPC D-330 SECTION 8-1992 在中国标准分类中归属于: L10 电子元件综合,在国际标准分类中归属于: 31.190 电子元器件组件。

 

Hybrid microelectronics and the use of ceramic printed boards represent viable approaches to electronic circuit packaging. As the term "hybrid" implies, this approach encompasses multiple technical disciplines which sometimes require compromises among process flow, component selection, and final package configuration. The purpose of this chapter is to present an overview of the hybrid microcircuit design procedure, to assist the design activity in the early identification of such compromises, as mentioned above, and to permit the selection of design and process alternatives that will emphasize the inherent advantages of this packaging technology.

标准号
IPC D-330 SECTION 8-1992
发布
1992年
发布单位
美国电子电路和电子互连行业协会
 
 

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