This document describes manufacturing process simulations for use with applicable component specifications to assure that electronic components can meet expected reliability requirements after exposure to assembly factory processes. It is not intended as an assembly production specification or a stand alone qualification document. The procedure consists of a set of assembly process simulations which can be performed by either the component user or manufacturer prior to reliability testing as specified in the applicable component qualification and reliability monitoring documents. The simulations include alternative conditions depending on the component type, physical characteristics and anticipated use.
IPC 9501-1995由美国电子电路和电子互连行业协会 US-IPC 发布于 1995-01-01。
IPC 9501-1995 在中国标准分类中归属于: L10 电子元件综合,在国际标准分类中归属于: 31.190 电子元器件组件。
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