This specification covers qualification
and performance of rigid printed boards. The
printed board may be single-sided, double-sided, with or
without plated-through holes. The printed board may be
multilayer with plated-through holes and with or without
buried/blind vias. The printed board may be multilayer
containing build up HDI layers conforming to IPC-6016.
The printed board may contain active embedded passive
circuitry with distributive capacitive planes, capacitive or
resistive components. The printed board may contain a
metal core or external metal heat frame, which may be
active or nonactive. Revision level changes are described
in 1.6.