The reported results are based on the work done by the Copper
Foil Ductility Round RobinTa sk Group, Werner Engelmaier,
Chairman, under the auspices of the MetaFloliicl S ubcommittee
of the Base Materials Committeeo f the Institute for Interconnecting
and Packaging Electronic Circuits (IPC).
qSTON, IL 60 1203-
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