Hybrid microelectronics and the use of ceramic printed boards represent viable approaches to electronic circuit packaging. As the term "hybrid" implies, this approach encompasses multiple technical disciplines which sometimes require compromises among process flow, component selection, and final package configuration. The purpose of this chapter is to present an overview of the hybrid microcircuit design procedure, to assist the design activity in the early identification of such compromises, as mentioned above, and to permit the selection of design and process alternatives that will emphasize the inherent advantages of this packaging technology.
IPC TM-650 5.1.150-1975由美国电子电路和电子互连行业协会 US-IPC 发布于 1975-01-01。
IPC TM-650 5.1.150-1975 在中国标准分类中归属于: G62 一般无机试剂,在国际标准分类中归属于: 71.040.30 化学试剂。
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