DIN EN 60749-20-2010 半导体器件.机械和气候试验方法.第20部分:塑料封装的表面安装器件抗湿气和焊接热的综合影响(IEC 60749-20-2008).德文版本EN 60749-20-2009
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009
This test method provides a means of assessing the resistance to soldering heat of plastic encapsulated surface mount devices (SMDs). This test is destructive.