IEC 60191-6-18:2010/COR2:2010
半导体器件的机械标准化.第6-8部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列(BGA)的设计指南
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)