IEC/TR 62258-3-2010
半导体压模产品.第3部分:搬运、包装和储存的良好实施推荐规程

Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage

IEC/TR 62258-3-2010 发布历史

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers, – singulated bare die, – die and wafers with attached connection structures, and – minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.

IEC/TR 62258-3-2010由国际电工委员会 IX-IEC 发布于 2010-08。

IEC/TR 62258-3-2010 在中国标准分类中归属于: L40 半导体分立器件综合，在国际标准分类中归属于: 31.080.99 其他半导体分立器件。

IEC/TR 62258-3-2010的历代版本如下：

• 2005年06月 IEC/TR 62258-3-2005 半导体压模产品.第3部分:搬运、包装和储存的良好实施规程建议
• 2010年08月 IEC/TR 62258-3-2010 半导体压模产品.第3部分:搬运、包装和储存的良好实施推荐规程

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标准号

IEC/TR 62258-3-2010

发布日期

2010年08月

实施日期

废止日期

无

中国标准分类号

L40

国际标准分类号

31.080.99

发布单位

IX-IEC

适用范围

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers, – singulated bare die, – die and wafers with attached connection structures, and – minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.

IEC/TR 62258-3-2010系列标准

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