IEC 61190-1-3 Edition 2.1-2010
电子组件用连接材料.第1-3部分:电子级钎焊合金及有焊剂和无焊剂要求电子焊接用固体焊料

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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标准号

IEC 61190-1-3 Edition 2.1-2010

发布日期

2010年11月01日

实施日期

2010年11月01日

废止日期

无

中国标准分类号

J33;L10

国际标准分类号

31.190

发布单位

IX-IEC

代替标准

IEC 61190-1-3-2017

适用范围

This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for “special” electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiplealloy solder powders, etc.