BS EN 61190-1-3-2007+A1-2010 电子组件用连接材料.电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料用要求
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for “special” electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This
standard is a quality control document and is not intended to relate directly to the material's
performance in the manufacturing process
Special electronic grade solders include all solders which do not fully comply with the
requirements of standard solder alloys and solder materials listed herein. Examples of special
solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder
powders, etc.