SAE J 1752/2-2011
采用从10 MHz到3 GHz的集成电路表面扫描方法(回路探测方法)的辐射排放测量

Measurement of Radiated Emissions from Integrated Circuits Surface Scan Method (Loop Probe Method) 10 MHz to 3 GHz


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标准号
SAE J 1752/2-2011
发布日期
2011年06月24日
实施日期
废止日期
中国标准分类号
T36
国际标准分类号
33.100.10;43.040.10
发布单位
US-SAE
引用标准
SAE J 1752/1-2006
被代替标准
SAE J 1752/2-2003
适用范围
This SAE Recommended Practice defines a method for evaluating the near field electric or magnetic component of the electromagnetic field at the surface of an integrated circuit (IC). This technique is capable of providing a detailed pattern of the RF sources internal to the IC. The resolution of the pattern is determined by the characteristics of the probes used and the precision of the mechanical probe positioner. The method is usable over the 10 MHz to 3 GHz frequency range with existing probe technology. The probe is mechanically scanned according to a programmed pattern in a plane parallel or perpendicular to the IC surface and the data is computer processed to provide a color-enhanced representation of field strength at the scan frequency. This procedure is applicable to measurements from an IC mounted on any circuit board that is accessible to the scan probe. For comparisons, the standardized test board shall be used. This diagnostic procedure is intended for IC architectural analysis including functional floor plan and power distribution.

SAE J 1752/2-2011系列标准





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