IEC 62047-12:2011
半导体器件.微电机器件.第12部分:使用MEMS结构共振的薄膜材料的弯曲疲劳测试方法

Semiconductor devices - Microelectromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

标准号

IEC 62047-12:2011

发布

2011年

发布单位

国际电工委员会

当前最新

IEC 62047-12:2011

 

 

被代替标准

IEC 47F/80/FDIS:2011

适用范围

This part of IEC 62047 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 ?? to 1 000 ?? in the plane direction and from 1 ?? to 100 ?? in thickness@ and test materials measuring under 1 mm in length@ under 1 mm in width@ and between 0@1 ?? and 10 ?? in thickness. The main structural materials for MEMS@ micromachine@ etc. have special features@ such as typical dimensions of a few microns@ material fabrication by deposition@ and test piece fabrication by means of non-mechanical machining@ including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures@ a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration.

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