EN 60068-2-83-2011 环境试验.第2-83部分:试验.Tf试验:利用焊锡膏润湿平衡法对表面安装装置(SMD)电子元件进行焊接性试验
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste