DS/EN 61192-1-2003

Workmanship requirements for soldered electronic assemblies - Part 1: General

DS/EN 61192-1-2003 发布历史

This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. This standard does not include hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate. It includes multichip modules assembled on organic substrates but excludes them when they are assembled on inorganic substrate surfaces such as ceramic or silicon.

DS/EN 61192-1-2003由丹麦标准化协会 DK-DS 发布于 2003-08-11，并于 2003-05-23 实施。

DS/EN 61192-1-2003在国际标准分类中归属于: 31.190 电子元器件组件。

DS/EN 61192-1-2003的历代版本如下：

• 2003年08月11日 DS/EN 61192-1-2003

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标准号

DS/EN 61192-1-2003

发布日期

2003年08月11日

实施日期

2003年05月23日

废止日期

无

国际标准分类号

31.190

发布单位

DK-DS

适用范围

This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. This standard does not include hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate. It includes multichip modules assembled on organic substrates but excludes them when they are assembled on inorganic substrate surfaces such as ceramic or silicon.

DS/EN 61192-1-2003系列标准