The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components.The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
DS/EN 62137-1-1-2008由丹麦标准化协会 DK-DS 发布于 2008-01-18,并于 2008-01-18 实施。
DS/EN 62137-1-1-2008在国际标准分类中归属于: 31.190 电子元器件组件。
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