DS/EN 62137-1-5-2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

DS/EN 62137-1-5-2009 发布历史

The test method described in this part of IEC 62137 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal

DS/EN 62137-1-5-2009由丹麦标准化协会 DK-DS 发布于 2009-07-29，并于 2009-07-29 实施。

DS/EN 62137-1-5-2009在国际标准分类中归属于: 31.190 电子元器件组件。

DS/EN 62137-1-5-2009的历代版本如下：

• 2009年07月29日 DS/EN 62137-1-5-2009

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标准号

DS/EN 62137-1-5-2009

发布日期

2009年07月29日

实施日期

2009年07月29日

废止日期

无

国际标准分类号

31.190

发布单位

DK-DS

适用范围

The test method described in this part of IEC 62137 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal

DS/EN 62137-1-5-2009系列标准