JIS C60068-2-83-2014 环境试验. 第2-83部分: 试验. 试验Tf: 利用焊锡膏湿平衡法进行的表面安装设备(SMD)电子元件的焊接性试验
Environmental testing -- Part 2-83: Tests -- Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste