This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240. This document is a modified version of existing types with the ad
DIN EN IEC 61837-2-2021由德国标准化学会 DE-DIN 发布于 2021-06-00,并于 2021-06-01 实施。
DIN EN IEC 61837-2-2021在国际标准分类中归属于: 01.100.25 电气和电子工程制图。
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