03.100.50 生产、生产管理 标准查询与下载

GSO IEC 62396-3:2015 航空电子运行部门 大气辐射的影响 第3部分：改进系统设计以适应大气辐射的单粒子 (SEE) 影响

This part of IEC 62396 provides guidance and furthermore it provides necessary requirements for those involved in the design of avionic systems and equipment and the resultant effects of atmospheric radiation-induced single event effects (SEE) on those avionic systems. The outputs of the activities and objectives described in this part of IEC 62396 will become inputs to higher level certification activities and required evidences. It builds on the initial guidance on the system level approach to single event effects in IEC 62396-1:2012, considers some avionic systems and provides basic methods to accommodate SEE so that system development assurance levels are met.

Process management for avionics - Atmospheric radiation effects - Part 3: System design optimization to accommodate the single event effects (SEE) of atmospheric radiation

GSO IEC 62396-2:2015 航空电子设备运行管理 大气辐射的影响 第2部分：航空电子系统单次效应测试指南

This part of IEC 62396 aims to provide guidance related to the testing of microelectronic devices for purposes of measuring their susceptibility to single event effects (SEE) induced by atmospheric neutrons. Since the testing can be performed in a number of different ways, using different kinds of radiation sources, it also shows how the test data can be used to estimate the SEE rate of devices and boards due to atmospheric neutrons at aircraft altitudes. Although developed for the avionics industry, this process may be applied by other industrial sectors.

Process management for avionics - Atmospheric radiation effects - Part 2: Guidelines for single event effects testing for avionics systems

GSO IEC 62396-4:2015 航空电子设备运营管理 大气辐射效应 第4部分：管理潜在单次效应的高压航空系统设计

This part of IEC 62396 provides guidance on atmospheric radiation effects and their management on high voltage (nominally above 200 V) avionics electronics used in aircraft operating at altitudes up to 60 000 ft (18,3 km). This part of IEC 62396 defines the effects of that environment on high voltage electronics and provides design considerations for the accommodation of those effects within avionics systems. This part of IEC 62396 provides technical data and methodology for aerospace equipment manufacturers and designers to standardise their approach to single event effects on high voltage avionics by providing guidance, leading to a standard methodology. Details are given of the types of single event effects relevant to the operation of high voltage avionics electronics, methods of quantifying those effects, appropriate methods to provide design and methodology to demonstrate the suitability of the electronics for the application.

Process management for avionics - Atmospheric radiation effects - Part 4: Design of high voltage aircraft electronics managing potential single event effects

GSO IEC/TS 62647-23:2015 航空电子运营管理 采用无铅焊料的航空航天和国防电子系统 第23部分：解决无铅电子和混合组件影响的开发和维修指南

This part of IEC 62647 provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as Sn-Pb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task. This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “rework/repair” is used as defined in 3.1.29 and 3.1.30. The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only. NOTE 1 For the purposes of this document, if the element “lead” is implied, it will be stated either as Pb, as lead (Pb), or as tin-lead. If a piece part terminal or termination “lead” is referred to, such as in a flat pack or a dual-inline package, the nomenclature lead/terminal or lead-terminal will be used. NOTE 2 Processes identified in the document apply to either rework or repair. This document may be used by other high-performance and high-reliability industries, at their discretion.

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

GSO IEC/TS 62500:2015 航空电子过程管理 定义和执行航空电子系统的高速测试 用户指南

This technical specification specifies the targets assigned to highly accelerated tests, their basic principles, their scope of application and their implementation procedures. It is primarily intended for programme managers, designers, test managers, and RAMS experts to facilitate the draft of the specification and execution of highly accelerated tests. This guide is applicable to all programmes and is of primary interest to the industrial firms in charge of designing, developing and producing equipment built for these programmes, and also their customers who, in drafting contractual clauses, may require that their suppliers implement highly accelerated tests. NOTE This technical specification applies to all types of equipment used in systems developed in these programmes, whatever their nature (electronic, electromechanical, mechanical, electro-hydraulic, electropneumatic, etc.) and whatever their size, from "low-level" subassemblies (PCBs, mechanical assemblies, connectors, etc.), up to system level groups of equipment.

Process management for avionics - Defining and performing highly accelerated tests in aerospace systems - Application guide

DB12/T 582-2015 企业班组安全生产基本规范

本标准适用于工业企业班组的安全生产，商贸等其他行业企业班组可参照执行

Basic norms of safe production for enterprise teams

BS 8541-6:2015 用于建筑、工程和施工的图书馆对象 产品和设施声明 业务守则

Library objects for architecture, engineering and construction. Product and facility declarations. Code of practice

GSO IEC/TS 62647-3:2014 航空电子设备的运营管理 包含无铅焊料的航空航天和电子防御系统 第3部分：包含无铅焊料的系统和成品的性能测试

This part of the IEC 62647 series defines for circuit card assemblies (CCA): – a default method for those companies that require a pre-defined approach, and – a protocol for those companies that wish to develop their own test methods. The intent of this document is not to prescribe a certain method, but to aid avionics/defence suppliers in satisfying the reliability and/or performance requirements of IEC/TS 62647-1 as well as support the expectations in IEC/TS 62647-21. The default method (see Clause 5) is intended for use by electronic equipment manufacturers, repair facilities, or programs that, for a variety of reasons, may be unable to develop methods specific to their own products and applications. It should be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing lead-free (Pb-free) solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of ADHP electronic equipment. The protocol (see Clause 6) is intended for use by manufacturers or repair facilities that have the necessary resources to design and conduct reliability, qualification, or process development tests that are specific to their products, their operating conditions, and their applications. Users of the protocol will have the necessary knowledge, experience, and data to customize their own methods for designing, conducting, and interpreting results from the data. Key to developing a protocol is a firm understanding of all material properties for the lead-free (Pb-free) material in question as well as knowledge of package- and board-level attributes as described in 5.3.2. As an example, research has shown that the mechanisms for creep can be different between tin-lead and tin-silver-copper (SAC) solders. Understanding these mechanisms is key to determining critical test parameters such as dwell time for thermal cycling. The protocol portion of this document provides guidance on performing sufficient characterization of new materials in order to accurately define test parameters. Use of the protocol is encouraged, since it is likely to yield more accurate results, and to be less expensive than the default method. The IEC/TS 62647-22 provides a comprehensive overview of those technical considerations necessary in implementing a test protocol. This specification addresses the evaluation of failure mechanisms, through performance testing, expected in electronic products containing lead-free (Pb-free) solder. One failure mode, fatigue-failure through the solder-joint, is considered a primary failure mode in ADHP electronics and can be understood in terms of physics of failure and life-projections. Understanding all of the potential failure modes caused by lead-free (Pb-free) solder of ADHP electronics is a critical element in defining early field-failures/reliability issues. Grouping of different failure modes may result in incorrect and/or misleading test conclusions. Failure analysis efforts should be conducted to insure that individual failure modes are identified, thus enabling the correct application of reliability assessments and life-projection efforts. IEC TS 62647-3:2014 © IEC 2014 When properly used, the methods or protocol defined in this specification can be used along with the processes documented in compliance to the IPC-SM-785, to satisfy, at least in part, the reliability requirements of the IPC-SM-785 and JESD22-B110A. Any portion of this document can be used to develop a lead-free (Pb-free) assembly test program, i.e., this document is tailorable and provides room for flexibility. For those situations in which results are used for reliability, verification, or qualification, stakeholder concurrence needs to be sought and documented so that expectations are understood and addressed. This specification may be used for products in all stages of the transition to lead-free (Pbfree) solder, including: • products that have been designed and qualified with traditional tin-lead electronic components, materials, and assembly processes, and are being re-qualified with use of lead-free (Pb-free) components; • products with tin-lead designs transitioning to lead-free (Pb-free) solder; and • products newly-designed with lead-free (Pb-free) solder. For programs that were designed with tin-lead solder, and are currently not using any leadfree (Pb-free) solder, the traditional methods may be used. It is important, however, for those programs to have processes in place to maintain the tin-lead configuration including those outsourced or manufactured by subcontractors. With respect to products as mentioned above, the methods presented in this document are intended to be applied at the level of assembly at which soldering occurs, i.e., circuit card assembly (CCA) level. This document may be used by other high-performance and high-reliability industries, at their discretion.

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes

GSO IEC/TS 62647-2:2014 航空电子设备的流程管理 含有无铅焊料的航空航天和国防电子系统 第2部分：减轻锡的有害影响

This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. This document may be used by other high-performance and high-reliability industries, at their discretion.

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

GSO IEC 61882:2014 危害和可操作性研究（HAZOP 研究） 应用指南

This International Standard provides a guide for HAZOP studies of systems utilizing the specific set of guide words defined in this document. It also gives guidance on application of the technique and on the HAZOP study procedure, including definition, preparation, examination sessions and resulting documentation and follow-up. Documentation, as well as a broad set of examples encompassing various industries, illustrating HAZOP examination is also provided.

Hazard and operability studies (HAZOP studies) - Application guide

GSO IEC/TS 62647-1:2014 航空电子设备的过程管理 包含无铅焊料的航空航天和国防电子系统 第1部分：无铅控制计划的准备

This part of the IEC/TS 62647 series defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. This specification aims to communicate requirements for a lead-free control plan (LFCP), hereinafter referred to as the Plan, and to assist the Plan owners in the development of their own Plans. The Plan documents the Plan owner’s processes to assure their customers and all other stakeholders that the Plan owner’s products will continue to meet their requirements, given the risks stated in the Introduction. This specification does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the ADHP industries that need to be addressed by the processes. Pb-free risk management should be accomplished through specific requirements added to the Plan owner’s existing infrastructure of product management and control. This specification applies to the ADHP electronics system supply chain. The control of the Pb-free activities will be accomplished by the Plan owner addressing the requirements of their Customer. These activities include, but are not limited to, those performed by the system integrator, the original equipment manufacturer (OEM), and their respective supply chains, to the lowest level possible. This should be done with the knowledge that, at the component level, the aerospace industry may not have a great influence over those suppliers. In such cases, the Plan owner assumes responsibility. Some applications may have unique requirements that exceed the scope of this specification. The extended scope should be covered separately. The requirements of this specification may be tailored to address unique/specific program needs. If tailoring is performed, the user will obtain documented customer concurrence. Annex A provides a tailoring template that may be used. This document may be used by other high-performance and high-reliability industries, at their discretion.

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan

GSO IEC/TS 62647-21:2014 航空电子设备的流程管理 包含无铅焊料的航空航天和国防电子系统 第21部分：项目管理 管理向无铅电子产品过渡的系统工程指南

This part of IEC 62647 is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and performance. Manufacturers of Aerospace, Defence and High Performance (ADHP) electronics may inadvertently introduce Pb-free elements (including piece part finish, printed wiring board (PWB) or printed circuit board (PCB) finish, or assembly solder) if careful coordination between buyer and supplier is not exercised. For example, piece part manufacturers may not always change part numbers to identify Pb-free finishes, especially if the previous tin-lead (Sn-Pb) finished piece part has been discontinued. Detailed examination of piece parts and documents at receiving inspection, while crucial, may not be sufficient to identify Pb-free piece parts. NOTE 1 Pb-free technology can impact any program regardless of whether the program itself is exempt or bound by environmental regulations. The industry conversion to Pb-free solder technology may affect an ADHP program in one or both of the following ways: 1) if the program is required to implement Pb-free technology (contract requirement, environmental regulation, etc), then the program manager/lead systems engineer will need to assess the impact of in-house transition with respect to design (performance of products using Pb-free) and process (processes to build Pb-free products); 2) if the program purchases COTS (commercial-off-the-shelf) items for its products/systems, then there is a very good chance that these items will contain Pb-free solder or Pb-free finishes on parts, printed wiring boards (PWBs), printed circuit boards (PCB), or circuit cards assemblies (CCA). The basic principles delineated in this document can be used for program management and/or systems engineering management of any aerospace and/or high performance program. The annexes in the document describe tools that can be used in conjunction with this document. 1) Annex A describes a matrix of product tier level versus associated risks with respect to a Pb-free transition. 2) Annex B contains links to the European Union Directives and Executive Order 13148. 3) Annex C contains a general program manager checklist for dealing with Pb-free issues that summarizes the content of this document. 4) Annex D contains a general manufacturing process assessment checklist to assess supplier compliance to IEC/TS 62647-1. 5) Annex E describes a recommended program language to assure performance, reliability, airworthiness, safety, and certifiability of Pb-free product(s). This document is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with IEC/TS 62647-1. Please note that the program manager and systems engineer (along with their respective organizations), and the appropriate enterprise authority work together in ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated accordingly. For the purposes of this document, “program management (or manager) and/or systems engineering management (or manager) and/or the appropriate enterprise authority” are defined as “program manager”. NOTE 2 The implications are that the program manager and systems engineering manager (along with their respective organizations) and the appropriate enterprise authority work together in ensuring that all impacts of Pbfree technology insertion are understood and risks mitigated accordingly. This document may be used by other high performance and high reliability industries at their discretion.

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics

GSO IEC/TS 62686-1:2014 航空电子设备的运营管理 航空航天、国防和高性能应用的电子元件 第1部分：高可靠性集成电路和分立半导体的一般要求

This part of IEC 62686 defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (Aerospace, Defence and High Performance) applications. This Technical Specification applies to all components that can be operated in ADHP applications within the manufacturers’ publicly available datasheet limits in conjunction with IEC/TS 62239-1. It may be used by other high performance and high reliability industries, at their discretion. ADHP application requirements may not necessarily be fulfilled by this specification alone. ADHP OEMs (original equipment manufacturers) may need to consider redesigning their products or conducting further testing to verify suitability in ADHP applications using their IEC/TS 62239-1 ECMP procedures. Alternatively a component in accordance with IEC/TS 62564-1 may be more suitable.

Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors

GSO IEC/TS 62647-22:2014 航空电子设备的流程管理 含有无铅焊料的航空航天和国防电子系统 第22部分：技术指南

This part of IEC 62647 is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment manufacturers (OEMs) and system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as ADHP) both during and after the transition to Pb-free electronics. The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to ensure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with IEC/TS 62647-1:2012. This document also contains lessons learned from previous experience with Pb-free aerospace electronic systems. The lessons learned give specific references to solder alloys and other materials, and their expected applicability to various operating environmental conditions. The lessons learned are intended for guidance only; they are not guarantees of success in any given application. This document may be used by other high-performance and high-reliability industries, at their discretion.

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines

GSO IEC 62396-1:2014 航空电子设备过程管理 大气辐射的影响 第1部分：航空电子设备内单粒子效应对大气辐射影响的兼容性

This part of IEC 62396 is intended to provide guidance on atmospheric radiation effects on avionics electronics used in aircraft operating at altitudes up to 60 000 feet (18,3 km). It defines the radiation environment, the effects of that environment on electronics and provides design considerations for the accommodation of those effects within avionics systems. This International Standard is intended to help aerospace equipment manufacturers and designers to standardise their approach to single event effects in avionics by providing guidance, leading to a standard methodology. Details of the radiation environment are provided together with identification of potential problems caused as a result of the atmospheric radiation received. Appropriate methods are given for quantifying single event effect (SEE) rates in electronic components. The overall system safety methodology should be expanded to accommodate the single event effects rates and to demonstrate the suitability of the electronics for the application at the component and system level.

Process management for avionics - Atmospheric radiation effects - Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment

GSO 2407:2014 石油和天然气行业 工作相关风险研究的实用建议

1.1 This Recommended Practice (RP) describes the methodology to be followed while performing the HAZOP Studies of Company Facilities. 1.2 This RP also provides guidance on formation of HAZOP Study Teams, roles / responsibilities of the team members, and documentation requirements for carrying out HAZOP studies.

Petroleum and natural gas industries - Recommended Practice (RP) For Hazop Studies

DB13/T 2149-2014 花卉示范园区建设管理规范

Specifications for the construction and management of flower demonstration gardens

GSO IEC/TS 62564-1:2013 航空航天合格电子元件 第1部分：微电路 航空电子运营部 航空航天合格电子元件 (AQEC) 第1部分：集成电路和分立半导体

This Part of IEC 62564, which is a Technical Specification, defines the minimum requirements for integrated circuits and semiconductors which are to be designated an “Aerospace Qualified Electronic Component (AQEC)”. It applies to integrated circuits and semiconductors exhibiting the following attributes: a) a minimum set of requirements, or information provided by the part manufacturer, which will allow a standard COTS component to be designated AQEC by the manufacturer; b) as a minimum, each COTS component (designated AQEC) will have been designed, fabricated, assembled, and tested in accordance with the component manufacturer’s requirements for standard data book components; c) qualification of, and quality systems for, the COTS components to be designated as AQEC shall include the manufacturer’s standards, operating procedures, and technical specifications. This information shall be available when requested; d) components manufactured before the manufacturer has addressed AQEC requirements, but utilizing the same processes, are also considered AQEC compliant; e) additional desired attributes of a device designated AQEC (that will support AQEC users) are found in Annex B of this technical specification. NOTE 1 Parts qualified to military specifications (except those identified as being for “logistic support” purposes only) are considered AQEC; the remainder of this technical specification only addresses non-military specification parts. NOTE 2 Parts qualified to AEC-Q100-Rev G, grade 0 through to grade 3 are considered AQEC. For those applications where a 0 °C to +70 °C temperature range is appropriate, grade 4 is also considered to be AQEC. The user should document that the grade category used is compatible with the application in accordance with their IEC/TS 62239 (due to be replaced by future IEC/TS 62239-1) electronic components management plan (ECMP).

Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors

GSO IEC/TS 62239-1:2013 航空电子运行管理 管理计划 第1部分：电子元件管理计划的准备和维护

IEC/TS 62239-1:2012(E) defines the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers and regulatory agencies that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that certain technical requirements are accomplished. In general, the owners of a complete electronic components management plan are avionics equipment manufacturers. Keywords: avionics, electronic components, management

Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan

DB44/T 1138-2013 空调器印刷电路板组件（PCBA）无铅焊点可靠性试验方法及质量要求

本标准规定了空调器印刷电路板组件（PCBA）无铅焊点可靠性试验方法、质量要求及检验规则。 本标准适用于空调器印刷电路板组件（PCBA）无铅焊点可靠性评定。 本标准不适用于特种空调。

Air conditioner printed circuit board assembly (PCBA) lead-free solder joint reliability test method and quality requirements