31.180 印制电路和印制电路板 标准查询与下载

LST EN IEC 61189-5-501:2021 电气材料、印制板和其他互连结构和组件的测试方法 第 5-501 部分：材料和组件的通用测试方法 助焊剂的表面绝缘电阻（SIR）测试（IEC 61189-5-501:2021）

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (IEC 61189-5-501:2021)

BS EN IEC 61189-5-301:2021 电气材料、印刷电路板和其他互连结构和组件的试验方法 材料和组件的通用试验方法 使用精细焊料颗粒的焊膏

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste using fine solder particles

OVE EN IEC 62878-2-5:2021 器件嵌入组装技术 第 2-5 部分：指南 器件嵌入基板的 3D 数据格式的实现（（IEC 62878-2-5:2019）EN IEC 62878-2-5:2019）（德语版）

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate ((IEC 62878-2-5:2019) EN IEC 62878-2-5:2019) (german version)

NF C93-735-301*NF EN IEC 61189-5-301:2021 电气材料、印制板和其他互连结构和组件的测试方法 第 5-301 部分：材料和组件的通用测试方法 使用细焊料颗粒的焊膏

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301 : general test methods for materials and assemblies - Soldering paste using fine solder particles

BS IEC 62899-402-3:2021 印刷电子产品 可打印性 质量测量 使用二维光学图像打印图案中的空隙

Printed electronics. Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image

DS/EN IEC 61188-6-1:2021 电路板和电路板组件“设计和使用”第 6-1 部分：焊盘图案设计“电路板上焊盘图案的通用要求

Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design – Generic requirements for land pattern on circuit boards

NF C93-711-6-1*NF EN IEC 61188-6-1:2021 电路板和电路板组件 设计和使用 第 6-1 部分：焊盘图案设计 电路板上焊盘图案的通用要求

Circuit boards and circuit board assemblies - Design and use - Part 6-1 : land pattern design - Generic requirements for land pattern on circuit boards

IEC 62899-402-3:2021 印刷电子产品 第 402-3 部分：可印刷性 质量测量 使用二维光学图像印刷图案中的空隙

This part of IEC 62899 specifies the optical measurement method for acquiring two-dimensional images of voids and obtaining the void-related attributes in the dried or cured printed patterns which are part of the electronic products in the field of printed electronics. The measur

Printed electronics - Part 402-3: Printability - Measurement of qualities - Voids in printed pattern using a two-dimensional optical image

DS/EN IEC 61189-5-502:2021 电工材料、印制板及其他互连结构和组件的试验方法 第5-502部分：材料和组件的通用试验方法 组件的表面绝缘电阻（SIR）测试

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 5-502: General test methods for materials and assemblies – Surface insulation resistance (SIR) testing of assemblies

DS/EN IEC 61188-6-2:2021 电路板和电路板组件“设计和使用”第 6-2 部分：焊盘图案设计“最常见的表面贴装元件（SMD）的焊盘图案说明

Circuit boards and circuit board assemblies – Design and use – Part 6-2: Land pattern design – Description of land pattern for the most common surface mounted components (SMD)

IEC 61189-5-301:2021 电气材料、印制板和其他互连结构和组件的试验方法第5-301部分:材料和组件的一般试验方法细焊料的焊膏

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine s

DS/EN IEC 61189-5-601:2021 电气材料、印制板及其他互连结构和组件的试验方法《第5-601部分：材料和组件的通用试验方法》

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-601: General test methods for materials and assemblies – Reflow soldering ability test for solder joint, and reflow heat resistance test for

DS/EN IEC 61189-5-501:2021 电气材料、印制板和其他互连结构和组件的测试方法 第 5-501 部分：材料和组件的通用测试方法 助焊剂的表面绝缘电阻（SIR）测试

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-501: General test methods for materials and assemblies – Surface insulation resistance (SIR) testing of solder fluxes

EN IEC 61189-5-501:2021 电气材料、印制板和其他互连结构和组件的测试方法 第 5-501 部分：材料和组件的通用测试方法 助焊剂的表面绝缘电阻（SIR）测试

IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

IEC 62899-202-7:2021 印刷电子.第202-7部分:材料.印刷薄膜.用90°剥离法测量柔性衬底上印刷层的剥离强度

Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method

PN-EN IEC 62496-4-214-2021-02 E 光电路板 第4-214部分：接口标准 使用单排三十二通道对称PMT连接器的端接波导OCB组件（IEC 62496-4-214:2020）

Optical circuit boards--Part 4-214: Interface standards--Terminated waveguide OCB assembly using a single-row thirty-two-channel symmetric PMT connector (IEC 62496-4-214:2020)

IEC 61189-5-601:2021 电气材料、印制板和其他互连结构和组件的试验方法第5-601部分:材料和组件的一般试验方法焊点的回流焊接能力试验和印制板的回流耐热试验

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability tes

PN-EN IEC 61189-5-504-2021-01 E 电气材料、印制板和其他互连结构和组件的测试方法 第5-504部分：材料和组件的通用测试方法 过程离子污染测试（PICT）（IEC 61189-5-504:2020）

Test methods for electrical materials, printed board and other interconnection structures and assemblies -- Part 5-504: General test methods for materials and assemblies -- Process ionic contamination testing (PICT) (IEC 61189-5-504:2020)

OVE EN IEC 61249-6-3:2021 印刷板和其他互连结构的材料 第 6-3 部分：增强材料的分规范集 成品织物规范

Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from \

T/ZZB 2017-2020 印制电路用铝基覆铜箔层压板

本文件规定了印制电路用铝基覆铜箔层压板（以下简称铝基覆铜板）的术语和定义、型号、命名、标识和代号、结构、基本要求、技术要求、检验规则、检验方法、包装、标志、运输和贮存及质量承诺。 本文件适用于印制电路用铝基覆铜箔层压板。

Aluminum basecopper-clad laminates for printed circuits