31.180 印制电路和印制电路板 标准查询与下载

KS C IEC 61249-2-2:2022 印制板和其他互连结构用材料第2-2部分:覆层和非覆层增强基材覆铜高电气级酚醛纤维素纸增强层压板

Materials for printed boards and other interconnecting structures —Part 2-2: Reinforced base materials, clad and unclad —Phenolic cellulose paper reinforced laminated sheets,high electrical grade, cop

KS C IEC 61249-2-2-2022 印制板和其他互连结构用材料第2-2部分:覆层和非覆层增强基材覆铜高电气级酚醛纤维素纸增强层压板

Materials for printed boards and other interconnecting structures —Part 2-2: Reinforced base materials, clad and unclad —Phenolic cellulose paper reinforced laminated sheets, high electrical grade, co

T/CPCA 6046-2022 埋置或嵌入铜块印制电路板规范

    本文件规定了埋置或嵌入铜块印制电路板的术语和定义、技术要求、检验方法、质量保证、包装、标识、运输和贮存等内容。适用于为埋置铜块印制电路板和嵌入铜块印制电路板结构和/或共性技术制成的埋置或嵌入铜块印制电路板提供鉴定及性能要求，为具有大功率或大电流的功率模块及传统的信号模块集成化的埋置或嵌入铜块印制电路板建立验收鉴定准则。     埋置或嵌入铜块PCB严格来说是有三种结构，即埋置铜块印制板、嵌入铜块印制板和同时具有埋置和嵌入铜块的印制板。因同时具有埋置和嵌入铜块的印制板在埋置铜块印制板或嵌入铜块印制板中均有单独体现其结构，故在本标准中只列出铜块印制板和嵌入铜块印制板两种结构。     该类印制板结构完整性包括了对残胶宽度、镀覆孔金属层裂缝、镀覆孔芯吸、连接盘起翘、金属化孔镀铜厚度、孔壁与不相连内层导体最小间距、阻焊剂厚度、阻焊剂塞孔、树脂塞孔、最终镀（涂）覆厚度、导体厚度、导线宽度、导线间距、导体层间绝缘层厚度、连接盘等的要求及规定。     电气性能主要对连通性、绝缘性、耐压性和耐电流几个方面提出了具体要求和检验方法。其中耐压性和耐电流是该类产品较为独特的性能要求，尤其涉及到汽车、轨道交通等应用领域的埋置或嵌入铜块印制板。

Specification for printed circuit board with buried or embedded copper coin

22/30442107 DC 印刷电子产品 第 507-1 部分 质量评估 印刷电极和铆钉连接至电线端子

Printed Electronics - Part 507-1. Quality assessment. Printed electrode and rivet connection to wire terminal

BS EN IEC 61189-2-501:2022 电气材料、印刷板和其他互连结构和组件的测试方法 互连结构材料的测试方法 回弹强度和回弹强度保留系数的测量...

1   Scope This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor…

T/JSQA 140-2022 高密度互连多层印制电路板

本团体标准规定了高密度互联多层印制电路板的术语和定义、产品分类、要求、试验方法、检验规则及标志、包装、运输和贮存。 技术要求规定了技术要求规定了尺寸公差、外观质量、电气性能、物理性能、机械性能、环境性能。 尺寸公差和外观质量，按照公司实际来确定。 电气性能、物理性能、机械性能和环境性能按照行业标准IPC-6012E-2020《刚性印制板的鉴定及性能规范》的相关要求来确定。

High pressure antibacterial refractory decorative board

T/GDCKCJH 062-2022 超级拼版多层印制电路板

本文件规定了超级拼版多层印制电路板的术语和定义、性能等级和类型、要求、试验方法、验收。

Super panelization on multilayer printed circuit board

ASTM D3380-22 聚合物基微波电路基板的相对介电常数（介电常数）和损耗因数的标准试验方法

1.1 This test method permits the rapid measurement of apparent relative permittivity and loss tangent (dissipation factor) of metal-clad polymer-based circuit substrates in the X-band (8 GHz to 12.4 GHz). 1.2 This test method is suitable for testing PTFE (polytetrafluorethylene) impregnated glass cloth or random-oriented fiber mats, glass fiber-reinforced polystyrene, polyphenyleneoxide, irradiated polyethylene, and similar materials having a nominal specimen thickness of 1⁄16 in. (1.6 mm). The materials listed in the preceding sentence have been used in commercial applications at nominal frequency of 9.6 GHz. NOTE 1—See Appendix X1 for additional information about range of permittivity, thickness other than 1⁄16 in. (1.6 mm), and tests at frequencies other than 9.6 GHz. 1.3 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. 1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates

T/CPCA 1001-2022 电子电路术语

本文件规定了电子电路技术的常用术语及其定义。 本文件适用于电子电路产业，包括印制电路板基材、设计与制造、检测、装联及相关领域。 本标准汇术语总共7大类1598条。其中基本术语70条、设计术语252条、基材术语254条、制造术语445条、品质与检测术语176条、封装与装联术语256条、管理及其它术语145条。另附有缩略语、中文索引和英文索引。

Electronic circuits vocabulary

IEC 61189-2-501:2022 电气材料、印制板和其他互连结构和组件的试验方法第2-501部分:互连结构材料的试验方法柔性电介质材料的回弹强度和回弹强度保持系数的测量

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resil

KS C 61249-2-10-2021 印制板和其他互连结构用材料.第2-10部分:包覆和未包覆增强基材.规定可燃性的氰酸酯溴化环氧改性或未改性编织E玻璃增强覆铜板（垂直燃烧试验）

Materials for printed boards and other interconnecting structures —Part 2-10: Reinforced base materials clad and unclad —Cyanate ester, brominated epoxide, modified or unmodified,woven E-glass reinfor

21/30432230 DC BS EN IEC 63203-402-3 可穿戴电子设备和技术 第 402-3 部分 可穿戴设备性能测量方法 系列 2：心率测定的准确性

BS EN IEC 63203-402-3. Wearable electronic devices and technologies - Part 402-3. Performance measurement method of wearables. Series 2: Accuracy of Heart Rate Determination

21/30447898 DC BS EN IEC 63203-402-2 可穿戴电子设备和技术 第 402-2 部分 健身可穿戴设备的性能测量 计步

BS EN IEC 63203-402-2. Wearable electronic devices and technologies - Part 402-2. Performance Measurement of Fitness Wearables. Step Counting

BS EN IEC 61189-2-807:2021 电气材料、印刷电路板和其他互连结构和组件的试验方法 互连结构材料的试验方法 使用TGA的分解温度（Td）

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA

DS/EN IEC 61189-2-807:2021 电气材料、印制板及其他互连结构和组件的试验方法 第2-807部分：互连结构材料的试验方法 分解温度（T;lt;sub;gt;d;lt;/sub;gt; ）使用 TGA

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition temperature (T;lt;sub;gt;d;lt;/sub;gt;) using TGA

BS PD IEC TR 62899-402-4:2021 印刷电子产品 可打印性 质量测量 形态学的分类和测量方法

Printed electronics. Printability. Measurement of qualities. Classification and measurement methods for morphology

LST EN IEC 62878-2-602:2021 器件嵌入组装技术-第2-602部分：堆叠电子模块指南-模块间电气连接的评估方法（IEC 62878-2-602:2021）

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021)

PN-EN IEC 61189-5-601-2021-10 E 电气材料、印制板及其他互连结构和组件的试验方法 第5-601部分：材料和组件的通用试验方法 焊点的回流焊能力试验和回流焊耐热性试验f

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-601: General test methods for materials and assemblies -- Reflow soldering ability test for solder joint, and reflow heat resistance test f

PN-EN IEC 61188-6-2-2021-10 E 电路板和电路板组件 设计和使用 第 6-2 部分：焊盘图案设计 最常见表面贴装元件（SMD）的焊盘图案描述（IEC 61188-6-2:2021）

Circuit boards and circuit board assemblies -- Design and use -- Part 6-2: Land pattern design -- Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021)

PN-EN IEC 61189-5-502-2021-10 E 电气材料、印制板和其他互连结构和组件的测试方法 第5-502部分：材料和组件的通用测试方法 组件的表面绝缘电阻（SIR）测试（IEC 61189-5-502:2021）

Test methods for electrical materials, printed board and other interconnection structures and assemblies -- Part 5-502: General test methods for materials and assemblies -- Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021)