31.180 印制电路和印制电路板 标准查询与下载

IEC 61189-5-2:2015 电气材料、印制板和其他互连结构和组件的测试方法 第 5-2 部分：材料和组件的通用测试方法 印制板组件的助焊剂

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering flux based on the existing IEC 61189-5 and IEC 61189-6. In addition@ it includes test methods of soldering flux for lead free soldering.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods materials and assemblies - Soldering flux for printed board assemblies

IEC 61189-5-4:2015 电气材料、印制板和其他互连结构和组件的测试方法 第 5-3 部分：材料和组件的通用测试方法 用于印制板组件的焊料合金和助焊剂和非助焊剂实心线

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys@ fluxed and non-fluxed solid wire@ based on existing IEC 61189-5 and IEC 61189-6. In addition@ it includes test methods for solder alloys@ fluxed and non-fluxed solid wire@ and for lead free soldering.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

IEC 61189-5-3:2015 电气材料、印制板和其他互连结构和组件的试验方法 第 5-3 部分：材料和组件的通用试验方法 印制板组件用焊膏

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition@ it includes test methods of soldering paste for lead free soldering.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

GOST R IEC 61193-3-2015 质量评估体系. 第3部分. 印制电路板, 层压最终产品及过程审计用抽样方案的选择和使用

Quality assessment systems. Part 3. Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

GSO IEC 61188-1-1:2014 印制板和印制板组件 设计和使用 第1-1部分：一般要求 电子组件的平整度考虑因素

This part of IEC 61188 describes those factors which control the flatness of rigid printed boards and their assemblies. The object of this standard is to inform the designer, manufacturer, assembler and user of rigid printed boards and their assemblies about those factors affecting their flatness. This standard incorporates advice regarding: – design (clause 3); – base material (clause 4); – unassembled printed boards (clause 5); – printed board assemblies (clause 6)

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

GSO IEC 61249-2-18:2014 印刷板和其他互连结构的材料 第2-18部分：层压和无涂层的增强基材 具有规定可燃性（垂直燃烧测试）的无纺聚酯玻璃纤维增强层压板 镀铜

This standard gives requirements for properties of polyester non-woven E-glass reinforced copper-clad laminated sheet, of defined flammability, in thicknesses of 0,80 mm to 1,60 mm. Some property requirements may have several classes of performance. The class desired must be specified on the purchase order, otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad

GSO IEC 61189-6:2014 电气材料、互连组件和结构的测试方法 第6部分：电子组件制造中使用的材料的测试方法

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

GSO IEC 61249-2-23:2014 印刷板和其他互连结构的材料 第2-23部分：层压和无涂层的增强基材 用非卤化酚醛纤维素纸增强的层压板 经济级 覆铜

This part of IEC 61249 gives requirements for properties of non-halogenated phenolic cellulose paper copper-clad laminated sheets, economic grade, in thicknesses of 0,8 mm up to 3,2 mm. This standard covers materials with different requirements on flammability and are designated according to the following: Material 61249-2-23-1: general purpose grade, requirement on flammability not specified; Material 61249-2-23-2: materials of defined flammability (vertical burning test). These grades of material provide for one of two flammability requirements and designated as FV0 or FV1 in Table 8. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material may be supplied.

Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

GSO IEC 61188-5-3:2014 印制板和印制板组件 设计和使用 第5-3部分：粘合（基极/结）注意事项 两侧带有鸥翼线的组件

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

GSO IEC 61189-5:2014 电气材料、互连组件和结构的测试方法 第5部分：印制板组件的测试方法

Abstract: IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

GSO IEC 61249-4-11:2014 印刷板材料和其他互连结构 第4-11部分：非涂层预浸料行业规范组 具有规定可燃性的非卤化氧化物编织无碱玻璃增强预浸料

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-7 when manufacturing multilayer boards according to IEC 62326-4. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated fire retardants contained as an integral part of the polymeric structure. After lamination according to the supplier’s instructions, the glass transition temperature is defined to be 120 °C minimum.

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

GSO IEC 61249-7-1:2014 互连结构材料 第7部分：带限制芯材料的行业规范组 第1节：铜/热塑性微合金/铜

This specification gives the requirements for copper-clad Invar material for use in the fabrication of metal-clad laminated sheets, used for printed boards. The use of copper-clad Invar material in printed boards modifies some properties of the boards, for example thermal capacity and coefficient of thermal expansion. This specification covers copper-clad Invar material of nominal thickness from 0,1 mm to 2,4 mm. It applies mainly to copper-clad Invar material supplied in rolls, but by agreement between purchaser and supplier it may be applied to copper-clad Invar material produced in sheets.

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper

GSO IEC 61249-8-8:2014 互连结构材料 第8部分：非导电涂层和薄膜的部门规范组 第8部分：临时聚合物涂层

This specification within the IEC 61249 series details requirements for the qualification of temporary solder resist coatings. These have been referred to as a mask in this specification since they have the facility of being readily removed. Peelable solder masks are applied (usually by screen printing) to areas of a completed printed board or panel prior to shipment, in order to protect areas of the board or panel during subsequent processes by the board assembler. Typically, peelable solder masks are used to protect keypad contacts during fluxing and subsequent mass soldering. Removal of the mask will then leave a residue-free untinned contact area. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks. Requirements for the release of printed boards using peelable solder masks should be included in the Customer Detail Specification (CDS). Requirements for the qualification of permanent polymeric solder resistive coatings are given in IEC 61249-8-51) , which has been used as a template in constructing this specification, in as far as it may apply.

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

GSO IEC 61249-8-7:2014 互连结构材料 第8部分：非导电涂层和薄膜的部门规范组 第7节：标记油墨

This specification details requirements for the qualification of marking inks used for legends and other identifications used on printed boards. Information in this specification will also provide guidance regarding the suitability of printed boards which feature marking inks. Requirements for the release of products using marking inks should be included in the customer detail specification (CDS).

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

GSO IEC 62496-1:2014 光电路板 第1部分：概述

IEC 62496-1 applies to optical circuit boards possessing all of the following general features: – transmit patterns with straight, cross, bending optical paths and input and output optical ports in plane; – optical paths consisting of optical fibres and/or optical waveguides; – controlled lengths of the optical paths, if required; – may be combined with a printed electric circuit board, the functionality of which is outside the scope of this standard; – functions to interconnect between optical components and the ability to mount components. The purpose of this standard is to specify optical circuit board requirements as they relate to − classification, − IEC standard system, − documentation, − materials, − workmanship, − performance, − identification − packaging.

Optical circuit boards - Part 1: General

GSO IEC 61249-2-12:2014 印刷板和其他互连结构的材料 第2-12部分：层压和无涂层增强基材的行业规范组 具有规定可燃性的非织造氧化物芳纶层压板 铜包层

This part of IEC 61249 gives requirements for properties of epoxide non-woven aramid copper-clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm. NOTE To designate this material, the reference: 61249-2-12-FV1-IEC-EP-AP-Cu may be used; if there is no risk of confusion, the type designation may be abbreviated to read IEC-61249-2-12-FV1.

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

GSO IEC 61188-5-8:2014 PCB 和 PCB 组件 设计和使用 第5-8节：互连注意事项 区域阵列元件（BGA、FBGA、CGA、LGA）

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design and the land pattern dimensions. The land pattern dimensions are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board. The existing models create a platform that is capable of establishing a reliable solder joint no matter which solder alloy is used to make that joint (lead-free, tin lead, etc.). Process requirements for solder reflow are different depending on the solder alloy and should be analyzed so that the process is taking place above the liquidus temperature of the alloy, and remains above that temperature a sufficient time to form a reliable metallurgical bond. Area array land patterns do not use "land protrusion" concepts and attempt to match the characteristics of the physical and dimensional termination properties. There are several configurations available, as shown in Figure 1. However, the tables provided show only the optimum dimension across the outer construction of the land.

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

GSO IEC 61249-2-1:2014 印刷板和其他互连结构的材料 第2-1部分：层压和无涂层增强基材 酚醛纤维素纸增强层压板 经济级 覆铜

This part of IEC 61249 gives requirements for properties of phenolic cellulose paper reinforced copper-clad laminated sheets, economic grade in thicknesses of 0,8 mm up to 3,2 mm. This standard covers materials with different requirements on flammability, designated according to the following: Material 61249-2-1-1: general purpose grade, requirement on flammability not specified (see 7.3.1); Material 61249-2-1-2: materials of defined flammability (vertical burning test) (see 7.3.2). These grades of material cover one of two flammability requirements, designated as FV0 or FV1 and shown in Table 8. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material may be supplied.

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

GSO IEC 61249-4-2:2014 印制板材料和其他互连结构 第4-2部分：未涂层预浸材料的部门规范组 用具有规定可燃性的改性或未改性聚酰亚胺编织而成的 E 型玻璃增强预浸材料

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-8 when manufacturing multilayer boards according to IEC 62326-4. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier’s instructions, the glass transition temperature is defined as 150 °C minimum

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

GSO IEC 61182-7:2014 印制板 电子数据的传输和描述 第7部分：以数字形式暴露的电路板的电气测试信息

This part of IEC 1182 is a supplement to IEC 1182-1, specifically in the area of describing bare board electrical test information. The material contained herein is intended to convey additional requirements, guidelines, and examples necessary to provide the data structures and concepts for bare board electrical test information in digital form.

Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form