31.180 印制电路和印制电路板 标准查询与下载

GSO IEC 61249-3-3:2014 印制板和其他互连结构的材料 第3-3部分：层压和无涂层增强基材的行业规范组 （适用于柔性印制板） 涂有粘合剂的柔性聚酯薄膜

This part of IEC 61249 gives requirements for flexible polyester (PETP) films coated on one side or both with polyester, acrylic or epoxide type adhesive for use in the fabrication of flexible printed wiring. Films coated on only one side are used as a coverlay or covercoat in the fabrication of flexible printed wiring. This coverlay or covercoat is also used to provide local support to areas subjected to mechanical or environmental stress. Films coated on both sides are used as bonding films in the fabrication of printed boards.

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

GSO IEC 61188-5-5:2014 印制板和印制板组件 设计和使用 第5-5部分：附件（焊盘/接头）注意事项 四侧带有鸥翼引线的元件

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design and the land pattern dimensions. The land pattern dimensions are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board. The existing models create a platform that is capable of establishing a reliable solder alloy used to make that joint (lead-free, tin lead, etc.). Process requirements for solder reflow are different based on the solder alloy and should be analyzed in order that the process is above that temperature a sufficient time to form a reliable metallurgical bond.

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

GSO IEC 61249-2-10:2014 印刷板和其他互连结构的材料 第2-10部分：包覆和未包覆的增强基材 氰酸酯、溴化环氧化物、改性或未改性、具有规定可燃性的编织 E 玻璃增强层压板（ver...

This part of IEC 61249 gives requirements for properties of cyanate ester, brominated epoxide modified or unmodified woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad, in thicknesses of 0,05 mm to 3,2 mm. The flammability rating is achieved through the use of brominated fire retardants contained as an integral part of the epoxide polymeric structure. The glass transition temperature is defined to be 160 °C minimum. Some property requirements may have several classes of performance. The class desired needs to be specified on the purchase order otherwise the default class of material may be supplied.

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (ver...

GSO IEC 61249-2-4:2014 印刷板和其他互连结构的材料 第2-4部分：层压和无涂层的增强基材 具有规定可燃性（垂直燃烧测试）的编织/非编织聚酯玻璃纤维层压板 镀铜

This standard gives requirements for properties of polyester woven fibreglass reinforced surface/non-woven fibreglass reinforced core copper-clad laminated sheet, of defined flammability, in thicknesses of 0,80 mm to 1,60 mm. Some property requirements may have several classes of performance. The class desired must be specified on the purchase order, otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad

GSO IEC 61249-2-12:2014 印刷板和其他互连结构的材料 第2-12部分：层压和无涂层增强基材的行业规范组 具有规定可燃性的非织造氧化物芳纶层压板 铜包层

This part of IEC 61249 gives requirements for properties of epoxide non-woven aramid copper-clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm. NOTE To designate this material, the reference: 61249-2-12-FV1-IEC-EP-AP-Cu may be used; if there is no risk of confusion, the type designation may be abbreviated to read IEC-61249-2-12-FV1.

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

GSO IEC 61189-1:2014 电气材料、互连结构和组件的测试方法 第1部分：通用测试方法和方法

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

GSO IEC 61249-8-8:2014 互连结构材料 第8部分：非导电涂层和薄膜的部门规范组 第8部分：临时聚合物涂层

This specification within the IEC 61249 series details requirements for the qualification of temporary solder resist coatings. These have been referred to as a mask in this specification since they have the facility of being readily removed. Peelable solder masks are applied (usually by screen printing) to areas of a completed printed board or panel prior to shipment, in order to protect areas of the board or panel during subsequent processes by the board assembler. Typically, peelable solder masks are used to protect keypad contacts during fluxing and subsequent mass soldering. Removal of the mask will then leave a residue-free untinned contact area. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks. Requirements for the release of printed boards using peelable solder masks should be included in the Customer Detail Specification (CDS). Requirements for the qualification of permanent polymeric solder resistive coatings are given in IEC 61249-8-51) , which has been used as a template in constructing this specification, in as far as it may apply.

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

GSO IEC 61249-2-22:2014 印刷板和其他互连结构的材料 第2-22部分：涂层和非涂层增强基材 用具有规定可燃性（垂直燃烧测试）的非卤化改性氧化物编织而成的无碱玻璃增强层压板和铜涂层

This part of IEC 61249 gives requirements for properties of modified non-halogenated epoxide woven E-glass laminated sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The flammability rating is achieved through the use of phosphorus compounds and/or aluminium hydroxide fire retardants contained as part of the polymeric structure. The glass transition temperature is defined to be between 150 °C to 190 °C. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad

GSO IEC PAS 61189-3-913:2014 电气材料、印刷板和其他互连组件和结构的测试方法 第3-913部分：互连结构（印刷板）的测试方法 高亮度发光二极管（LED）电路板

This standard specifies the test methods of the electronic circuit board for high-brightness LEDs (hereafter described as electronic circuit board). NOTE Reference documents to this standard are listed in Clause 11 Normative references and in the Bibliography.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) - Electronic circuit board for high-brightness LEDs

GSO IEC/PAS 61249-6-3:2014 印刷面板用“E”型玻璃成品编织材料规范

This specification covers finished fabrics woven from :E” glass electrical grade glass fiber yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave. 1.1 Purpose This specification determines the nomenclature, definitions, general and chemical requirements for the glass, and physical requirements for finished woven glass fiber fabrics. 1.2 Designation Appendix II of this standard provides a style designator for each finished fabric glass style, with specifications on yarn, fabric count, thickness and weight in both SI and US system. Fabrics listed in Appendix II also categorize fabrics by their current availability status.

Specification for finished fabric woven from "E" glass for printed boards

GSO IEC 61249-2-6:2014 印刷板和其他互连结构的材料 第2-6部分：增强基材 包覆和未包覆 具有规定可燃性的溴化环氧无纺布/无纺布 E 玻璃增强层压板（垂直燃烧测试） 铜包覆

This part of IEC 61249 gives requirements for properties of brominated epoxide nonwoven/woven reinforced E-glass laminated sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,80 mm up to 1,70 mm. The flammability rating is achieved through the use of brominated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 95 °C minimum. Some property requirements may have several classes of performance. The class desired needs to be specified on the purchase order otherwise the default class of material may be supplied.

Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

GSO IEC 61188-5-1:2014 印制板和印制板组件 设计和使用 第5-1部分：附件（焊盘/接头）注意事项 通用要求

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

GSO IEC 61249-4-11:2014 印刷板材料和其他互连结构 第4-11部分：非涂层预浸料行业规范组 具有规定可燃性的非卤化氧化物编织无碱玻璃增强预浸料

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-7 when manufacturing multilayer boards according to IEC 62326-4. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated fire retardants contained as an integral part of the polymeric structure. After lamination according to the supplier’s instructions, the glass transition temperature is defined to be 120 °C minimum.

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

GSO IEC 61182-7:2014 印制板 电子数据的传输和描述 第7部分：以数字形式暴露的电路板的电气测试信息

This part of IEC 1182 is a supplement to IEC 1182-1, specifically in the area of describing bare board electrical test information. The material contained herein is intended to convey additional requirements, guidelines, and examples necessary to provide the data structures and concepts for bare board electrical test information in digital form.

Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form

GSO IEC/PAS 62326-20:2014 印制板 第20部分：高亮度 LED 电路板

This PAS specifies the properties of the electronic circuit board for high-brightness LEDs (hereafter described as “ECB”). NOTE Standards relevant to the present standards are given below. JPCA-TD01 Terms and definitions for printed circuits JIS C 5603 Terms and definitions for printed circuits

Printed boards - Part 20: Electronic circuit board for high-brightness LEDs

GSO IEC 62326-1:2014 印制板 第1部分：通用规格

This part of IEC 62326 defines capability approval (CA) procedures for printed boards. When IECQ recognition is required, the capability approval procedures of IEC 001002 should be used. In addition, a technology approval (TA) schedule may also be provided as an alternative for manufacturers employing a system of process control for establishing product conformity. Both CA and TA procedures apply to printed boards irrespective of their methods of manufacture, when they are ready for the mounting of components. The information and requirements may also be used for second-party approvals or for self-declaration by a manufacturer of products covered by these specifications.

Printed boards - Part 1: Generic specification

GSO IEC 61249-2-1:2014 印刷板和其他互连结构的材料 第2-1部分：层压和无涂层增强基材 酚醛纤维素纸增强层压板 经济级 覆铜

This part of IEC 61249 gives requirements for properties of phenolic cellulose paper reinforced copper-clad laminated sheets, economic grade in thicknesses of 0,8 mm up to 3,2 mm. This standard covers materials with different requirements on flammability, designated according to the following: Material 61249-2-1-1: general purpose grade, requirement on flammability not specified (see 7.3.1); Material 61249-2-1-2: materials of defined flammability (vertical burning test) (see 7.3.2). These grades of material cover one of two flammability requirements, designated as FV0 or FV1 and shown in Table 8. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material may be supplied.

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

GSO IEC 61188-5-8:2014 PCB 和 PCB 组件 设计和使用 第5-8节：互连注意事项 区域阵列元件（BGA、FBGA、CGA、LGA）

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design and the land pattern dimensions. The land pattern dimensions are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board. The existing models create a platform that is capable of establishing a reliable solder joint no matter which solder alloy is used to make that joint (lead-free, tin lead, etc.). Process requirements for solder reflow are different depending on the solder alloy and should be analyzed so that the process is taking place above the liquidus temperature of the alloy, and remains above that temperature a sufficient time to form a reliable metallurgical bond. Area array land patterns do not use "land protrusion" concepts and attempt to match the characteristics of the physical and dimensional termination properties. There are several configurations available, as shown in Figure 1. However, the tables provided show only the optimum dimension across the outer construction of the land.

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

GSO IEC 61189-3:2014 电气材料、印制板和其他互连组件和结构的试验方法 第3部分：互连结构（印制板）的试验方法

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

GSO IEC 61249-2-21:2014 印制板和其他互连结构用材料 第2-21部分：涂层和非涂层增强基材 -用规定可燃性（垂直燃烧试验）的非卤化氧化物编织的无碱玻璃增强层压板和铜涂层

This part of IEC 61249 gives requirements for properties of non-halogenated epoxide woven Eglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad in thicknesses 0,05 mm up to 3,2 mm. The flammability rating is achieved through the use of non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire retardants are contained as part of the polymeric structure or in addition to it. The glass transition temperature is defined to be 120 °C minimum. Some property requirements may have several classes of performance. The class desired must be specified on the purchase order, otherwise the default class of material may be supplied.

Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad