31.180 印制电路和印制电路板 标准查询与下载
共找到 1623 条与 印制电路和印制电路板 相关的标准，共 109 页
BS EN IEC 61249-2-52 Materials for printed boards and other interconnecting structures - Part 2-52. Reinforced base materials clad and unclad. Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined…
- ICS
- 31.180
- CCS
- 发布
- 2023-09-12
- 实施
- 2023-09-12
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for time to delamination. T260, T288, T300
- ICS
- 31.180
- CCS
- 发布
- 2023-08-31
- 实施
- 2023-08-31
本文件规定了汽车开关导电膜与面板粘合技术规范的术语和定义、基本要求、粘合步骤和要求、验收要求。
Technical specification for bonding between conductive film and panel of automotive switches
- ICS
- 31.180
- CCS
- C356
- 发布
- 2023-08-25
- 实施
- 2023-08-31
Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
- ICS
- 31.180
- CCS
- 发布
- 2023-08-16
- 实施
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
- ICS
- 31.180
- CCS
- 发布
- 2023-07-26
- 实施
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
- ICS
- 31.180
- CCS
- 发布
- 2023-07-26
- 实施
Test methods for electrical materials, printed boards and other interconnection structures and assemblies — Part 5-4: General test methods for materials and assemblies — Solder alloys and fluxed and n
- ICS
- 31.180
- CCS
- 发布
- 2023-06-30
- 实施
Test methods for electrical materials, printed boards and other interconnection structures and assemblies — Part 5-3: General test methods for materials and assemblies — Soldering paste for printed bo
- ICS
- 31.180
- CCS
- 发布
- 2023-06-30
- 实施
Test methods for electrical materials, printed boards and other interconnection structures and assemblies — Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightne
- ICS
- 31.180
- CCS
- 发布
- 2023-06-30
- 实施
Test methods for electrical materials, printed boards and other interconnection structures and assemblies — Part 2-719: Test methods for materials for interconnection structures — Relative permittivit
- ICS
- 31.180
- CCS
- 发布
- 2023-06-30
- 实施
Test methods for electrical materials, printed boards and other interconnection structures and assemblies — Part 5-2: General test methods for materials and assemblies — Soldering flux for printed boa
- ICS
- 31.180
- CCS
- 发布
- 2023-06-30
- 实施
本文件规定了汽车开关导电膜与面板粘合技术规范的术语和定义、基本要求、粘合步骤和要求、验收要求。
Technical specification for bonding of switch conductive film
- ICS
- 31.180
- CCS
- C354
- 发布
- 2023-06-29
- 实施
- 2023-07-01
本文件规定了单面和双面碳膜印制板的要求、测试方法、质量保证、标识、包装、运输及贮存要求。 本文件适用于刚性单面和双面碳膜印制电路板，不适用于电位器类的碳膜印制电路板。
Single & double-sided printed circuit board with carbon conductor
- ICS
- 31.180
- CCS
- C3990
- 发布
- 2023-06-28
- 实施
- 2023-07-28
本文件规定了导电阳极丝热成像辅助定位失效分析方法的原理、试验条件、仪器设备、试剂和材料、样品、试验步骤以及试验报告的要求。 本文件适用于导电阳极丝试验过程中/后绝缘阻值低于108Ω的印制板。
Failure analysis method of thermal imaging-assisted positioning for conductive anodic filament
- ICS
- 31.180
- CCS
- C398
- 发布
- 2023-06-21
- 实施
- 2023-09-21
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
- ICS
- 31.180
- CCS
- 发布
- 2023-06-16
- 实施
- 2023-09-15 (7)
Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
- ICS
- 31.180
- CCS
- 发布
- 2023-06-14
- 实施
本文件规定了刚性覆铜板材料、LCP/MPI挠性覆铜板材料、LTCC基板材料、焊锡膏材料、导热绝缘垫片材料和敷形涂覆材料等通信用材料的批次一致性评价方法。 本文件适用于通信用新产品、新工艺、新应用的产业化需求的刚性覆铜板材料、LCP/MPI挠性覆铜板材料、LTCC基板材料、焊锡膏材料、导热绝缘垫片材料和敷形涂覆材料的关键性能一致性评价。
Guidelines for batch consistency evaluation of critical properties of new materials for communication
- ICS
- 31.180
- CCS
- C398
- 发布
- 2023-06-12
- 实施
- 2023-09-12
BS EN IEC 62899-402-1. Printed electronics - Part 402-1. Printability. Measurement of qualities. Line pattern widths
- ICS
- 31.180
- CCS
- 发布
- 2023-06-02
- 实施
- 2023-06-02
本文件规定了通讯设备用关键材料施加高频信号电磁辐射环境试验方法，包括原理、环境条件、仪器设备、样品要求、系统校准、测试步骤、注意事项和试验报告等内容。 本文件适用于片状的固体材料。 频率测试范围：26.5 GHz~40 GHz； 电场强度测试范围：1000 V/m~3000 V/m。
Electromagnetic radiation environment test method for key materials used in communications
- ICS
- 31.180
- CCS
- C398
- 发布
- 2023-06-01
- 实施
- 2023-09-01
