31.190 电子元器件组件 标准查询与下载

NF C90-730-4:2003 钎焊电子组件的工艺要求.第4部分:终端组件

Workmanship requirements for soldered electronic assemblies - Part 4 : terminal assemblies.

NF C90-730-1:2003 钎焊电子组件的工艺要求.第1部分:总则

Workmanship requirements for soldered electronic assemblies - Part 1 : general.

IPC 2221A-2003 印刷电路板的设计通用标准

This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections may be single, double, or multilayered.

Generic Standard on Printed Board Design [Superseded: IPC D-275]

IPC 0040-2003 光电子组装和封装技术

This document addresses the implementation of optical and optoelectronic packaging technologies.

Optoelectronics Assembly and Packaging Technology

BS EN 61192-3:2003 钎焊电子组件的工艺要求.通孔安装组件

This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

Workmanship requirements for soldered electronic assemblies - Through-hole mount assemblies

LST EN 61190-1-1-2003 用于电子组装的附件材料 第 1-1 部分：电子装配中高质量互连的助焊剂要求（IEC 61190-1-1:2002）

Attachment materials for electronic assembly. Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002)

LST EN 61193-1-2003 质量评估系统 第1部分：印制板组件缺陷的登记和分析（IEC 61193-1:2001）

Quality assessment systems. Part 1: Registration and analysis of defects on printed board assemblies (IEC 61193-1:2001)

IPC 2251-2003 高速电子电路包装的设计指南,取代IPC-D-317A-317A:1995年1月

This standard establishes requirements and other considerations

Design Guide for the Packaging of High Speed Electronic Circuits

IEC 61192-3:2002 钎焊电子组件的工艺要求.第3部分:通孔安装组件

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally thro

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

IEC 61192-4:2002 钎焊电子组件的工艺要求.第4部分:终端组件

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or m

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

DS/EN 61193-1:2002 质量评估系统 第1部分：印制板组件缺陷的登记和分析

This part of IEC 61193 defines methods of registration and analysis of defects on soldered printed board assemblies. Methods are described to allow effective comparison of performance between products, processes and production loacations and can serve as a basis for general quality improvement.

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

DS/EN 61190-1-1:2002 电子装配用连接材料 第 1-1 部分：电子装配中高质量互连用助焊剂的要求

This part of IEC 61190 specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

IPC CC-830B-2002 电气绝缘复合印刷线路组装的条件和执行

This standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the materials with minimum test redundancy. This standard covers:

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies Incorporates Amendment 1: October 2008

IPC 2252-2002 射频/微波电路板设计指南

This standard establishes requirements and other considerations

Design Guide for RF/Microwave Circuit Boards

IPC 2547-2002 印刷电路板的测试,检验和返修车间设备通信信息(CAMX)分段要求

Factory Information Systems (FIS) form the nervous system of an enterprise, analyzing data and delivering information to the machines and people who need to make information-based decisions. These systems provide a bi-directional flow of information between the factory floor and the rest of the enterprise and beyond.

Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Rework

IPC 4552-2002 印刷电路板化学镀镍/浸金(ENIG)镀规格

This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM).

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

IPC D-356B-2002 裸露基板电气测试数据格式

This standard describes a data format for transmitting bare board electrical test information. The material contained herein is intended to convey requirements, guidelines, and examples necessary to provide the data structures and concepts for bare board electrical test information in digital form, including data suitable for computer aided repair. When used as a netlist input to test data processing, the receiver of IPC-D-356B data will determine test point assignments and positioning.

Bare Substrate Electrical Test Data Format

IEC 61193-1:2001 质量评定系统 第1部分：印制版组装件缺陷的登记和分析

This part of IEC 61193 defines methods of registration and analysis of defects on soldered printed board assemblies. Methods are described to allow effective comparison of perform-ance between products, processes and production locations and can serve as a basis for general quality improvement. The standard specifies defect data collection in two categories. Category 1 ppm data: this category provides data for registration purposes intended to enable overall performance comparison of assembly operations. Category 2 ppm data: this category provides data intended for individual subprocess assessment, analysis and control purposes.

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

IEC 61189-1:2001 互连结构和附件用电气材料的试验方法.第1部分:一般试验方法和方法论

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

IEC 61189-1:1997/AMD1:2001 电气材料、互连结构和组装的试验方法 第1部分:一般试验方法和分类 修改1

This is Amendment 1 to IEC 61189-1-1997 (TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - Part 1: General test methods and methodology)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology; Amendment 1