31.190 电子元器件组件 标准查询与下载

IPC AJ-820 SECTION 4.0-1997 电子电路元件

Whether a printed circuit is to be a prototype, or a high-volume

Electronic Circuit Components

IPC AJ-820 SECTION 6.0-1997 IPC-CM770,印制电路板组件安装方针

Whether a printed circuit is to be a prototype, or a high-volume

IPC-CM770,Guidelines for Printed Board Component Mounting

IEC 61189-2:1997 电气材料、互连结构和组装的试验方法 第2部分:互连结构用材料的试验方法

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

IEC 61189-1:1997 电气材料、互连结构和组装的试验方法 第1部分:一般试验方法和分类

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

IPC PE-740A SECTION 10-1997 电镀

IPC Standards and Publications are designed to serve the public interest through

Electroplating

IPC PE-740A INTRO-1997 印制电路板制造和装配的疑难解答

Just include spec information Focus on end product performance Include a feed back system on use and problems for future improvement

Troubleshooting for Printed Board Manufacture and Assembly

IPC PE-740A SECTION 7-1997 电镀过程

IPC Standards and Publications are designed to serve the public interest through

Electroless Processes

IPC PE-740A SECTION 18-1997 印制电路板组件清洗

IPC Standards and Publications are designed to serve the public interest through

Cleaning of Printed Board Assemblies

IPC PE-740A-1997 印制电路板制造和装配的修订版A的疑难解答

IPC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of IPC from manufacturing or selling products not conforming to such Standards and Publication, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than IPC members, whether the standard is to be used either domestically or internationally.

Troubleshooting for Printed Board Manufacture and Assembly Revision A

IPC 9201-1996 外部绝缘电阻手册

Surface Insulation Resistance (SIR) testing has been with the electronics industry since the advent of the transistor and printed circuit board. It has been used as a tool for: incoming inspection; materials investigations and qualifications; quality conformance; prediction of long-term failure mechanisms; and as a predictive tool for estimated service life.

Surface Insulation Resistance Handbook

IPC D-279-1996 可靠的外部贴装技术印制电路板组件设计指南

This document establishes design concepts, guidelines, and procedures intended to promote appropriate ‘Design for Reliability (DfR)’ procedures and to ensure reliable printed wiring assembly (PWA) characteristics. The major focus of the information presented is directed toward those PWAs that have surface mount (SM) components, either totally, or intermixed with through-hole components, mounted on one or both sides of the mounting structure.

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

IPC 3406-1996 导电外部贴装胶粘剂准则

This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect systems. The focus is on the use of adhesives as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure as much as possible. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (unidirectional conductivity), are covered. The two major divisions of polymer adhesives, thermosets and thermoplastics, are described.

Guidelines for Electrically Conductive Surface Mount Adhesives

IPC 3408-1996 各向异性导电胶薄膜一般要求

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the foliowing: flexible PWB-to-glass, flexible PWB-to-rigid PW, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.

General Requirements for Anisotropically Conductive Adhesive Films

JIS C 0806:1995 连续胶带上电子元器件的包装(表面包装设备)

Packaging of electronic components on continuous tapes (surface mounting devices)

VDI/VDE 3715-1995 SMD 表面贴装设备 印刷电路板（PCB）的过程测量和测试

Das Dokument gibt einen Überblick, welche Arbeitsschritte für die Herstellung einer gemischt bestückten LPBG (Leiterplattenbaugruppe) (SMD beidseitig und bedrahtete Ergänzungsbestückung) erforderlich sind.*www.vdi.de/3715

SMD - Surface Mount Devices - Process measurement and testing for printed circuit boards (PCB)

IEC 60297-4:1995 电子设备用机械结构件.482.6mm(19 in)系列机械结构件的尺寸 第4部分:分机柜和相关插入单元 附加尺寸

Mechanical structures for electronical equipment - Dimensions of mechanical structures of the 482,6 mm(19 in) series - Part 4: Subracks and associated plug-in units - Additional dimensions

IPC CA-821-1995 热导电胶的一般要求

This document covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for their long term properties as a part of the printed wiring board.

General Requirements for Thermally Conductive Adhesives

IPC 9501-1995 为评价电子元件的印制线路板装配过程模拟

This document describes manufacturing process simulations for use with applicable component specifications to assure that electronic components can meet expected reliability requirements after exposure to assembly factory processes. It is not intended as an assembly production specification or a stand alone qualification document. The procedure consists of a set of assembly process simulations which can be performed by either the component user or manufacturer prior to reliability testing as specified in the applicable component qualification and reliability monitoring documents. The simulations include alternative conditions depending on the component type, physical characteristics and anticipated use.

PWB Assembly Process Simulation for Evaluation of Electronic Components

BS EN 60917-2:1994 研制电子设备机械构件用模块排序.第2部分:25 mm设备接口配合尺寸规格的实施规程

This part of IEC 917 may be applied to all fields of electronics in which equipment and installations with a modular design are used. The object of this part of IEC 917 is to define a sectional specification for the mechanical structure of a 25 mm equipment practice to provide for dimensional compatibility at mechanical interfaces with related engineering applications, e.g. plug-in units, printed boards, components, instrumentation, furniture, rooms, buildings, etc. It specifies the co-ordination dimensions and pitches for cabinets, racks, subracks and chassis of all types used for electronic equipment in, for example industrial electronics, information technology, measurement and control systems and communications. The chosen co-ordination dimensions for the mechanical structure for heights, widths and depths, lie within a homogeneous, metric modular three-dimensional grid as specified in IEC 917. In this part of IEC 917, the mounting pitches 25 mm and 2,5 mm have been used as a base to determine the interface co-ordination dimensions for the electronic equipment practice. This creates the optimum conditions for the application of computer-aided methods throughout design and manufacture such as, for instance, computer-aided planning, development, manufacturing, testing and installation. The cabinets and racks in this part of IEC 917 represent a specific structural form which takes into consideration for instance the installation of subracks and chassis. The determined interface co-ordination dimensions for the overall outside and aperture dimensions of subracks provide space for independently created plug-in units to be installed. These plug-in unit dimensions shall follow the rules of IEC 917-0 and IEC 917 and are to be determined in detail specifications. The connector system used (0,5; 1,0; 2,0; 2,5 mm, etc. connector grid) and the special application requirements are to be determined in associated detail specifications. Further standards may be used in conjunction with this part of IEC 917: IEC 297-1:1986, Dimensions of mechanical structures of the 482.6 mm (19 inch) series -Part 1: Panels and racks. IEC 297-2:1982, Dimensions of mechanical structures of the 482,6 mm (19 inch) series -Part 2: Cabinets and pitches of rack structures.

Modular order for the development of mechanical structures for electronic equipment practices - Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice

DIN EN 60917-2:1994 电子设备机械构件模块化研制规定.第2部分:分规范.25mm设备接口配合尺寸

The document defines a sectional specification of the mechanical structure of a 25 mm equipment practice to provide for dimensional compatibility at mechanical interfaces with related engineering applications, e.g. plug-in units, printed boards, components, instrumentation, furniture, rooms, building, etc.

Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice (IEC 60917-2:1992); German version EN 60917-2:1994