31.200 集成电路、微电子学 标准查询与下载
共找到 3192 条与 集成电路、微电子学 相关的标准，共 213 页
本标准给出了磁随机存储(Magnetic Random-Access Memory; MRAM)芯片测试方法的术语、测试原理、测试环境、测试设备、测试程序等。 本标准适用于磁随机存储芯片测试和磁随机存储芯片关键性能（可靠性和电学参数等）验证。
Magnetic random access memory chip test method
- ICS
- 31.200
- CCS
- I6550
- 发布
- 2021-12-23
- 实施
- 2022-03-03
4 缩略语 5 设计要求 6 设计流程 7 设计工具 8 服务内容 9 设计服务确认 10 服务考核与持续改进
Technical specification for digital chip back-end physical design services
- ICS
- 31.200
- CCS
- C3990
- 发布
- 2021-12-07
- 实施
- 2021-12-07
本文件规定了晶圆级扇出型封装（FOWLP）的外形尺寸。 本文件适用于晶圆级扇出型封装（FOWLP）的成品设计和成品尺寸检验。
Oultine dimensions of Fan-out Wafer-Level Package
- ICS
- 31.200
- CCS
- C397
- 发布
- 2021-11-10
- 实施
- 2021-11-10
本文件规定了堆叠封装(PoP)下封装体的外形尺寸。 本文件适用于堆叠封装(PoP)下封装体（以下简称下封装）的成品设计和成品尺寸检验
Outline Dimensions of Package on Package Lower Package
- ICS
- 31.200
- CCS
- C397
- 发布
- 2021-11-10
- 实施
- 2021-11-10
本文件规定了堆叠封装(PoP)上封装体的外形尺寸。 本文件适用于堆叠封装(PoP)上封装体（以下简称上封装）的成品设计和成品尺寸检验。
Outline Dimensions of Package on Package Upper Package
- ICS
- 31.200
- CCS
- C397
- 发布
- 2021-11-10
- 实施
- 2021-11-10
General Rules for Reliability Assured Analogue Semiconducter Integrated Circuits
- ICS
- 31.200
- CCS
- 发布
- 20210928
- 实施
- 20210928
Semiconductor integrated circuits－Part 2：Digital integrated circuits Section 10－Blank detail specification for integrated circuit dynamic read/write memories(excluding uncommitted logic arrays)
- ICS
- 31.200
- CCS
- 发布
- 20210928
- 实施
- 20210928
Semiconductor integrated circuits－Part 2：Digital integrated circuits Section One：Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
- ICS
- 31.200
- CCS
- 发布
- 20210928
- 实施
- 20210928
Semiconductor devices－integrated circuits－Part 2：Digital integrated circuits
- ICS
- 31.200
- CCS
- 发布
- 20210928
- 实施
- 20210928
Electronic components -- Long-term storage of electronic semiconductor devices -- Part 7: Micro-electromechanical devices (IEC 62435-7:2020)
- ICS
- 31.200
- CCS
- 发布
- 2021-08-31
- 实施
- 2021-08-31
Artificial Intelligence Chip Benchmark Test Evaluation Method
- ICS
- 31.200
- CCS
- L56
- 发布
- 2021-08-21
- 实施
- 2021-11-01
Integrated circuits - EMC evaluation of transceivers - Part 5: Ethernet transceivers (IEC 62228-5:2021)
- ICS
- 31.200
- CCS
- 发布
- 2021-08-16
- 实施
- 2021-08-16
Integrated circuits - EMC evaluation of transceivers - Part 7: CXPI transceivers (IEC 47A/1121/CDV) (english version)
- ICS
- 31.200
- CCS
- 发布
- 2021-08-15
- 实施
- 2021-08-15
Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ?/150 ? direct coupling method (IEC 61967-4:2021)
- ICS
- 31.200
- CCS
- 发布
- 2021-07-15
- 实施
- 2021-07-15
IEC 62228-2:2016 specifies test and measurement methods for EMC evaluation of LIN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for standard LIN transceiver ICs and ICs with embedded LIN transceiver and covers: - the emission of RF disturbances, - the immunity against RF disturbances, - the immunity against impulses and - the immunity against electrostatic discharges (ESD).
Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers
- ICS
- 31.200
- CCS
- 发布
- 2021-07-01
- 实施
IEC 62433-3:2017 provides a method for deriving a macro-model to allow the simulation of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called Integrated Circuit Emission Model - Radiated Emission, ICEM-RE. The model is intended to be used for modelling a complete IC, with or without its associated package, a functional block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output pins, digital core and supply), when measured or simulated data cannot be directly imported into simulation tools.
EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
- ICS
- 31.200
- CCS
- 发布
- 2021-07-01
- 实施
IEC 62433-4:2016 specifies a flow for deriving a macro-model to allow the simulation of the conducted immunity levels of an integrated circuit (IC). This model is commonly called Integrated Circuit Immunity Model - Conducted Immunity, ICIM-CI. It is intended to be used for predicting the levels of immunity to conducted RF disturbances applied on IC pins. In order to evaluate the immunity threshold of an electronic device, this macro-model will be inserted in an electrical circuit simulation tool. This macro-model can be used to model both analogue and digital ICs (input/output, digital core and supply). This macro-model does not take into account the non-linear effects of the IC. The added value of ICIM-CI is that it could also be used for immunity prediction at board and system level through simulations. This part of IEC 62433 has two main parts: - the electrical description of ICIM-CI macro-model elements; - a universal data exchange format called CIML based on XML. This format allows ICIM-CI to be encoded in a more useable and generic form for immunity simulation.
EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)
- ICS
- 31.200
- CCS
- 发布
- 2021-07-01
- 实施
EMC IC modelling -- Part 6: Models of integrated circuits for Pulse immunity behavioural simulation -- Conducted Pulse Immunity (ICIM-CPI) (IEC 62433-6:2020)
- ICS
- 31.200
- CCS
- 发布
- 2021-06-16
- 实施
- 2021-06-16
Integrated circuits. EMC evaluation of transceivers. Ethernet transceivers
- ICS
- 31.200
- CCS
- 发布
- 2021-06-11
- 实施
- 2021-06-11
Integrated circuits – EMC evaluation of transceivers – Part 5: Ethernet transceivers
- ICS
- 31.200
- CCS
- 发布
- 2021-06-08
- 实施
- 2021-06-08
