49.025.05 黑色金属合金综合 标准查询与下载

ECA 540DAAA-A-1994 电子设备用双列直插式两接触片开关的详细规范

This docimient is copyrighted by the EIA and may not be reproduced without permission,

Detail Specification for Dual In-Line Two-Piece Contact Socket for Use in Electronic Equipment

ECA 540G000-1993 电子设备用烧进插孔分规范

This Sectional Specification relates to burn-in sockets of assessed quality. The purpose of this Specification is to provide a means of assuring interchangeability between devices and compatibility between the board and the chip carrier and to provide

Sectional Specification for Burn-In Sockets for Use in Electronic Equipment

ECA 540GAAA-1993 电子设备用带模压载体环的片式载体封装烧进插座的详细规范

The Burn-In Sockets of assessed quality covered by this Detail Specification shall have Maximum enclosure dimensions that include insertion cover and actuator hardware as illustrated in Figure 1.

Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment

ECA 540GA00-1993 电子设备用带模压载体环的片式载体封装烧进插座的空白详细规范

The instructions for the numbers in brackets, below, indicate the information to be inserted in the corresponding location in the BDS. In the BDS proper, information contained in parentheses are abbreviated instructions for completing the BDS. Informat

Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment

ECA 540E000-1993 电子设备用圆形插座的部分规范

This Sectional Specification relates to sockets designed for round-style electronic components of assessed quality. The purpose of this Specification is to provide a means of assuring interchangeability between devices and compatibility between the boar

Sectional Specification for Round-Style Sockets for Use in Electronic Equipment

ECA 280-C-1992 无焊料包装的电子连接

Lists of typical materials commonly used in industry are included, but other materials may be used to make solderless wrapped connections providing the connections meet the requirement so this standard.Environmental and aging test, frequency of inspecti

Solderless Wrapped Electrical Connections

ECA 540FA00-1992 电子设备用多组件插孔的空白详细规范

The instruction for the numbers in brackets, below, indicate the information to be inserted in the corresponding location in the blank detail specification (BDS). To make it cover a specific detail for a Mutti-Package Module Socket. In the BDS text inform

Blank Detail Specification for Multi-Package Module Sockets for Use in Electronic Equipment

ECA 540ADAA-1992 电子设备用载体方形扁平封装到格栅阵列插座上的适配器的详细规范

The Quad Flat Pack carrier of assessed quality covered by this detail specification shall have

Detail Specification for Adaptor-Carrier Quad Flatpack to Pin Grid Array Sockets for Use in Electronic Equipment

ECA 540FAAB-1992 用于电子设备的直角安装格式模块插座,多包装100 Mil的详细规范

This document is copyrighted by the EIA and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement with the ETA For information, contact EIA Engineer

Detail Specification for Multi-Package 100 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment

ECA 540FAAA-1992 电子设备用间距100密耳多插件垂直安装组件插孔的详细规范

The Muiti-Package Moduie Sockets of assess& quality covered by this Detail Specification shall have Maximum enclosure dimensions (See Figure 1.)

Detail Specification for Multi-Package 100 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment

ECA 540FAAC-1992 电子设备用间距50密耳多插件垂直安装组件插孔的详细规范

The Multi-Package Module Sockets d 885Bss8d quality covered by this Detail Specification shall have Maximum enclosure dimensions (See Figure 1.)

Detail Specification for Multi-Package 50 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment

ECA 540FAAD-1992 用于电子设备的直角安装格式模块插座,多包装50 Mil的详细规范

The Multi-Package Module Sockets d 885Bss8d quality covered by this Detail Specification shall have Maximum enclosure dimensions (See Figure 1.)The Multi-Package Module Sockets d 885Bss8d quality covered by this Detail Specification shall have Maximum enc

Detail Specification for Multi-Package 50 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment

ECA 580A000-1992 用于电子设备的固定芯片电容器的部分规范

This standard applies to fixed chip capacitors for direct current, with metallized electrodes and polyethyleneterephthalate dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended

Sectional Specification for Fixed Chip Capacitors with Metallized Electrodes and Polyethylene-Terephthalate Dielectric for Use in Electronic Equipment

ECA 540DAAB-1991 用于电子设备的柔性双线插座的详细规范

The Dual In-Line Sockets of assessed quality covered by this Detail Specification shall have

Detail Specification Flexible Carrier 2 Piece Dual In-Line Socket for Use in Electronic Equipment

ECA 540DA00-1991 电子设备用双列直插式开关的空白详细规范

The instructions for the numbers in brackets, below,indicate the information to be inserted in the corresponding location in the blank detail specifidon (BDS), to make it cover a specific detail for a Dual In-Line Socket. In the BDS text information conta

Blank Detail Specification for Dual In-Line Sockets for Use in Electronic Equipment

ECA 540BAAC-1991 电子设备用引线格栅阵列(PGA)器件的非机控柔性载体插座详细规范

Standards Proposal No. 5103, Proposed revision of TP-1OC “Fluid Immersion Test Procedure for Electrical Connectors” if approved, to be published as ANSVEINECA-364-1 OD).

Detail Specification Nonmechanically Actuated Flexible Carrier Sockets for Pin Grid Array for Use in Electronic Equipment

ECA 540AC00-1991 电子设备引线塑料芯片载体(PCC)组件的片载插孔

The instructions for the numbers in brackets, below, indicate the information to be inserted in the corresponding location in the BDS. In the BDS proper, information contained in parentheses are abbreviated instructions for completing the BDS. Information

Blank Detail Specification for Chip Carrier Sockets for Plastic Chip Carrier (PCC) Packages with"J" Type Leads for Use in Electronic Equipment

ECA 540AD00-1991 电子设备用载体方形扁平封装到格栅阵列插座上的适配器的空白详细规范

The instructionsfor the numbers in brackets, below, indicate the information to be inserted In the corresponding location in the blank detail specification (BDS),to make it cover a specific detail for adaptorcartier quad flat pack. In the BDS text informa

Blank Detail Specification for Adaptor - Carrier Quad Flat Pack to Pin Grid Array Sockets for Use in Electronic Equipment

ECA 540AA00-1991 电子设备用无引线A、B或D型片载插孔的空白详细规范

The instructions for the numbers in brackets, below, indicate the information to be inserted in the corresponding location in the BDS. In the BDS proper, information contained in parentheses is abbreviated instructions for completing the BDS. Information

Blank Detail Specification for Chip Carrier Sockets for Leadless Type A, B or D Chip Carriers for Use in Electronic Equipment

ECA 540AB00-1991 电子设备用塑料方形扁平组件片载插孔的空白详细规范

The instructions for the numbers in brackets, below, indicate the information to be nserted in the corresponding location in the BDS. In the BDS proper, information contained in parentheses is abbreviated instructions for completing the BDS. Information

Blank Detail Specification for Chip Carrier Sockets for Plastic Quad Flat Packages for Use in Electronic Equipment