L04 基础标准与通用方法 标准查询与下载

JEDEC JEP143B-2008 固态可靠性评估和鉴定方法学

This publication applies to all integrated circuits and their associated packages. The document summarizes the suite of reliability documents and publications available. These documents address reliability qualification, reliability stress testing, and reliability modeling. The purpose of this publication is to provide an overview of some of the most commonly used systems and test methods historically performed by manufacturers to assess and qualify the reliability of solid state products. The appropriate references to existing and proposed JEDEC or joint standards and publications are cited. This document is also intended to provide an educational background and overview of some of the technical and economic factors associated with assessing and qualifying microcircuit reliability.

Solid State Reliability Assessment and Qualification Methodologies

IPC/JEDEC J-STD-020D.1-2008 非气密固态表面安装装置用潮湿/回流灵敏性分类

This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated surface mount packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices. If no major changes have been made to a previously qualified SMD package, this method may be used for reclassification according to 4.2. This standard cannot address all of the possible component, board assembly and product design combinations. However, the standard does provide a test method and criteria for commonly used technologies. Where uncommon or specialized components or technologies are necessary, the development should include customer/manufacturer involvement and the criteria should include an agreed definition of product acceptance. SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020, JESD22-A112 (rescinded), or IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a higher peak classification temperature is desired. Annex B provides an overview of major changes from Revision C to Revision D of this document. Note: If the procedures in this document are used on packaged devices that are not included in this specification’s scope, the failure criteria for such packages must be agreed upon by the device supplier and their end user.

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

NF C20-790-5-1:2008 静电学.第5-1部分:静电现象中电子装置的保护.一般要求

Electrostatics - Part 5-1 : protection of electronic devices from electrostatic phenomena - General requirements.

ANSI/ASME Y14.44-2008 电气和电子部件和设备用参考名称

This Standard covers the formation and application of reference designations for electrical and electronics parts and equipment.

Reference Designations for Electrical and Electronics Parts and Equipments

ANSI/EIA 468-C:2008 自动处理用径向结构元件的引线用带系扎

Provide dimensions and tolerances necessary to lead tape components in the radial format (unidirectional leads) such that they may be automatically handled.

Lead Taping of Components in the Radial Configuration for Automatic Handling

BS EN 61193-2:2007 质量评估体系.第2部分:电子元件和包装件的检验用抽样策略的选择和使用

This part of IEC 61193 applies to the inspection of electronic components, packages, and also modules (referred to as “products” in this standard) for use in electronic and electric equipment. It specifies sampling plans for inspection by attributes on the assumption that the acceptance number is zero (Ac = 0), including criteria for sample selection and procedures. The zero acceptance number sampling plans provided by this standard apply to the inspection of products, that are manufactured under suitable process control with the target of a “zerodefect” quality level before sampling inspection. In addition, this standard provides a method for the calculation of the expected value of the statistical verified quality limit (SVQL) at a confidence level of 60 %. Amongst other things, this method can be used to verify the effectiveness of the supplier’s process control. NOTE In this standard the term “module” is used for products which are modules according to the definition in IEC 60194.

Quality assessment systems - Selection and use of sampling plans for inspection of electronic components and packages

JIS C 6950 AMD 1:2007 信息技术设备的安全性(修改件1)

JIS C 6950:2006は改正され，一部が置き換えられた。今回の改正は，電気用品安全法に係る省令の改正に対応するために，シュレッダの安全性要求事項を追加したものである。

Safety of information technology equipment (Amendment 1)

KS X ISO/IEC 11770-4:2007 信息技术.安全技术.密钥管理.第4部分:基于弱机密的机制

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Information technology-Security techniques-Key management-Part 4:Mechanisms based on weak secrets

IEC 62529:2007 信号和试验定义用标准

This standard provides the means to define and describe signals used in testing. It also provides a set of common basic signals, mathematically underpinned so that signals can be combined to form complex signals usable across all test platforms. The provision of language elements supports test signal descriptions for interoperability. This standard is divided into seven clauses: — Clause 1 provides an introduction to this standard. — Clause 2 provides definitions of terms and lists abbreviations. — Clause 3 describes the structure of the STD standard. — Clause 4 specifies the signal modeling language (SML). — Clause 5 specifies the STD basic signal components (BSCs). — Clause 6 defines the test signal frameworks (TSFs). — Clause 7 describes the test procedure language (TPL) layer. This standard also contains the following annexes: a) Annex A provides the Signals Modeling Language that is used to construct the BSCs and the TSFs. b) Annex B provides BSC descriptions. c) Annex C provides dynamic signal model description, states, and state transitions. d) Annex D provides the interface definition language (IDL) description for the BSCs. e) Annex E provides a TSF. This framework provides a formal description of signals similar to the signals defined in IEEE Std 716-1995. It also serves to illustrate how complex test signal models can be built up from BSCs. f) Annex F provides the IDL description for the TSF provided in Annex E. g) Annex G defines the requirements for a carrier language. h) Annex H provides the formal TPL description. i) Annex I provides the extensible markup language (XML) description mapping signal models into XML descriptions. j) Annex J provides XML description mapping the TSF provided in Annex E into XML descriptions. k) Annex K provides a description of how ATLAS nouns and noun modifiers are supported by STD. l) Annex L provides a bibliography of related documents.

Standard for signal and test definition

KS X ISO/IEC 11802-2:2007 信息技术.系统间电信和信息交换.局域网和城域网.第2部分:标准组合MAC地址

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Information technology-Telecommunications and information exchange between systems-Local and metropolitan area networks-Part 2:Standard group MAC address

BS EN 60068-3-11:2007 环境测试.第3-11部分:支持文件和指南.气候试验室条件的不确定性计算

This part of IEC 60068 demonstrates how to estimate the uncertainty of steady-state temperature and humidity conditions in temperature and humidity chambers. Since this is inextricably linked to the methods of measurement, these are also described. This standard is equally applicable to all environmental enclosures, including rooms or laboratories. The methods used apply both to temperature chambers and combined temperature and humidity chambers. This standard is meant to help everyone using climatic test chambers. Those already familiar with uncertainty of measurement will find it useful for guidance on typical sources of uncertainty and how they should be quantified and combined. It is also intended to assist the first-time or occasional user who has little or no knowledge of the subject. To discuss uncertainty, it is important first to understand what is being measured or characterized. The calibration or characterization of the performance of a chamber is concerned with the humidity and temperature of the air in the chamber, as experienced by the item under test, at a given set point. This should not be confused with characterizing or calibrating the chamber sensor, which is a separate matter.

Environmental testing - Supporting documentation and guidance - Calculation of uncertainty of conditions in climatic test chambers

GJB 6083-2007 电子对抗装备随机文件要求

本标准规定了通用电子对抗装备随机文件的构成、内容、格式和印制要求。 本标准适用于系统类、分系统（单站）类、单机（分机）类电子对抗装备随机文件（以下简称随机文件）的编制。

Requirements of auxiliary documents for EW equipment

IEC 61340-5-1:2007 静电学.第5-1部分:静电现象中电子装置的保护.一般要求

This part of IEC 61340 applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts, assemblies and equipment susceptible to damage by electrostatic discharges greater than or equal to 100 V human body model (HBM). This standard provides the requirements for an ESD control program. The user should refer to IEC 61340-5-2 for guidance on the implementation of this standard. This standard does not apply to electrically initiated explosive devices, flammable liquids, gases and powders. The purpose of this standard is to provide the administrative and technical requirements for establishing, implementing and maintaining an ESD control program (hereinafter referred to as the “program”).

Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements

IEC TR 61340-5-2:2007 静电学.第5-2部分:静电现象中电子设备的防护.用户指南

This technical report has been developed to support IEC 61340-5-1. The controls and limits referenced in this standard were developed to protect devices that are susceptible to discharges of 100 V or greater using the human body model test method. However, the general concepts are still valid for devices that are susceptible to discharges of less than 100 V.

Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide

BS EN 60068-2-82:2007 环境测试.试验.试验Tx:电子和电气元件用晶须试验方法

This part of IEC 60068 specifies whisker tests for electric or electronic components representing the finished stage, with tin or tin-alloy finish. However, the standard does not specify tests for whiskers that may grow as a result of external mechanical stress. This test method is employed by a relevant specification (international component or application specification) with transfer of the test severities to be applied and with defined acceptance criteria. Where tests described in this standard are considered for other components, e.g. mechanical parts as used in electrical or electronic equipment, it should be ensured that the material system and whisker growth mechanisms are comparable.

Environmental testing - Tests - Test Tx - Whisker test methods for electronic and electric components

BS EN 60068-2-69:2007 环境测试.试验.试验Te:用润湿平衡法对表面安装设备(SMD)电子元件的软钎焊性试验

This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

Environmental testing - Tests - Test Te - Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

IEC 60068-2-69:2007 环境测试.第2-69部分:试验.试验Te:用润湿称量法进行表面安装装置(SMD)的电子元件的可焊性测试

This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

BS EN 81714-2:2007 产品技术文件用图形符号的设计.用于参考文库及其交换要求的计算机可感知形状,含识别标志的图形符号规范

This part of International Standard 81714 specifies requirements for graphical symbols to be included in a reference symbol library in a computer sensible form, and requirements for their interchange among computer aided tools. The reference symbol library may be used as a basis for the design and editing of documents, and for the interchange of documents and graphical symbol libraries among computer-aided tools. The specification of a physical file format required for the interchange is not included in this standard.

Design of graphical symbols for use in the technical documentation of products. Specification for graphical symbols in a computer sensible form, including graphical symbols for a reference library, and requirements for their interchange

YD/T 1633-2007 电磁兼容性现场测试方法

本标准规定了在设备安装现场进行测试时的性能判据、骚扰和抗扰度等的电磁兼容性测量方法。 本标准适用于由于不便运输或要求特定环境条件而必须在设备安装现场进行电磁兼容性测量的设备。

Test Methods of Electromagnetic Compatibility on-Site

ANSI/UL 60950-1-2007 信息技术设备.安全性.第1部分:一般要求

The Proposed Second Edition of the Standard for Information Technology Equipment - Safety - Part 1: General Requirements, UL 60950-1. Proposed changes to Annex NAD, Acoustic Tests.

UL Standard for Safety Information Technology Equipment �C Safety �C Part 1: General Requirements (Second Edition; Reprint with Revisions Through and Including OCTOBER 14@ 2014)