L05 可靠性和可维护性 标准查询与下载

ANSI/TIA-455-16-A-2000 纤维光学元件用盐雾(腐蚀)试验

This document describes a test method intended to determine the effects of a controlled salt-laden atmosphere on fiber optic interconnecting devices, finishes, and mechanisms.

Salt Spray (Corrosion) Test for Fiber Optic Components

IEC 61163-1/COR1:1999 可靠性应力筛选.第1部分:批生产可修复产品

Reliability stress screening - Part 1: Repairable items manufactured in lots

BS IEC 60300-3-7:1999 可靠性管理.应用指南.电子硬件的可靠性应力筛选

This part of IEC 60300 serves as an application guide to a reliability stress screening process for electronic hardware. The concept, purpose and justification of the screening process are explained. The main elements of a screening programme are stated, together with the general planning procedure. This standard is intended as a guide and should be used in conjunction with one of the IEC reliability stress screening standards, ("tools" in the toolbox concept), referenced in clause 15, based on the screening process application level. This standard gives guidance in cases where it is essential that early failures be removed from the items manufactured in order to deliver them to the customer when the problems causing the early failures are solved. The standard also gives guidance on where the reliability stress screening should be carried out, i.e. component level, subsystem level, or system level (see figure 1), and can also be used where steps to reduce the risk of early failures are included in a contract. This standard is aimed at personnel in the contract department, project management, product development, process management, production, quality control and purchasing.

Dependability management - Application guide - Application guide - Reliability stress screening of electronic hardware

JEDEC JESD659-A-1999 故障机械传动可靠性监测

Timely and accurate root cause failure analysis and the establishment and maintenance of an effective corrective action system are of critical importance to an electronic component supplier's ability to effectively develop new products, introduce them to volume manufacture, and support their successful use in customer applications. For customer-initiated problem analysis or corrective action requests, the initial response, failure analysis, and corrective action turnaround time requirements vary widely. The driving factors that determine problem analysis and corrective action priorities and resultant turnaround times are the impact on the customer, the impact on the supplier, and the complexity of the component problem.

Failure-Mechanism-Driven Reliability Monitoring

IEC 60319:1999 电子元器件可靠性数据的表示和规范

This International Standard gives guidance for the collection and presentation of data necessary to understand the reliability characteristics of a component. It also gives guidance to component users as to how they should specify their reliability requirements to component manufacturers. It makes no distinction between data on failures or operation without failures or faults. Such factual information, derived from laboratory tests, should be available to the circuit and equipment designers to enable evaluation of the reliability of circuits and systems.

Presentation and specification of reliability data for electronic components

JEDEC JEP136-1999 信号分析

Signature Analysis

Signature Analysis

IEC 60300-3-7:1999 可信性管理 第3-7部分:应用指南 电子硬件可靠性应力筛选

This part of IEC 60300 serves as an application guide to a reliability stress screening process for electronic hardware. The concept, purpose and justification of the screening process are explained. The main elements of a screening programme are stated, together with the general planning procedure. This standard is intended as a guide and should be used in conjunction with one of the IEC reliability stress screening standards, ("tools" in the toolbox concept), referenced in clause 15, based on the screening process application level. This standard gives guidance in cases where it is essential that early failures be removed from the items manufactured in order to deliver them to the customer when the problems causing the early failures are solved. The standard also gives guidance on where the reliability stress screening should be carried out, i.e. component level, subsystem level, or system level (see figure 1), and can also be used where steps to reduce the risk of early failures are included in a contract. This standard is aimed at personnel in the contract department, project management, product development, process management, production, quality control and purchasing.

Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware

IEC 60300-3-11:1999 可信性管理 第3-11部分:应用指南 可靠性为中心的维修

This part of IEC 60300 provides guidelines for the development of an initial preventive maintenance programme for equipment and structures using reliability centred maintenance (RCM) analysis techniques. References to a maintenance programme in this standard implies that it is a preventive maintenance programme. This application guide is an extension of IEC 60706-4. Those maintenance activities recommended in IEC 60706-4 which relate to preventive maintenance may be implemented using reliability centred maintenance methodology. RCM analysis can be applied to items such as a ground vehicle, ship, power station, aircraft, etc, which are made up of equipment and structure, e.g. a building, airframe or ship's hull. Typically an equipment comprises a number of electrical, mechanical, instrumentation or control systems and subsystems which can be further broken down into progressively smaller groupings, as required. RCM techniques specifically applicable to structures are given in annex A. This standard is restricted to the application of RCM techniques and does not include aspects of maintenance support, which are covered by other standards in the IEC 60706 series.

Dependability management - Part 3-11: Application guide - Reliability centred maintenance

JEDEC JEP134-1998 顾客提供的半导体仪器失败分析背景信息指南

This Guideline addresses acquiring and transmitting pertinent background information that a failure analyst should have to complete an accurate and timely failure analysis of a semiconductor device. To this end, a suggested background-data form and explanations of its data items are included.

Guidelines for Preparing Customer-Supplied Background Information Relating to a Semiconductor-Device Failure Analysis

NF C20-343:1998 电子元件.可靠性.换算用失效率和应力模型的基准条件

Electronic components. Reliability. Reference conditions for failure rates and stress models for conversion.

IEEE 1332-1998 电子系统和设备开发与生产的可靠性程序

Encouracges suppliers and customers to cooperatively integrate their reliability processes.

Standard Reliability Program for the Development and Production of Electronic Systems and Equipment

ARMY MIL-HDBK-1857-1998 成键和屏蔽设计接地手册

MIL-STD-1857 has been redesignated as a handbook, and is to be used for guidance purposes only. This document is no longer to be cited as a requirement. For administrative expediency, the only physical change from MIL-STD-1857 is this cover page. However, this document is no longer to be cited as a requirement. If cited as a requirement, contractors may disregard the requirements of this document and interpret its contents only as guidance.

HANDBOOK FOR GROUNDING, BONDING AND SHIELDING DESIGN PRACTICES

ARMY MIL-HDBK-1280-1998 键盘安排手册

These military standard keyboard arrangements are intended for general purpose, typewriter-like, alphanumeric keyboards implementing the Military Standard Coded Character Set(Table 1, Apgendix I, HIL-STD-188~)i):whicihs the USA Standard Code for Information Interchange(ASCII)(USAS x3.4-1967) adapted to military communication systems and the USA Standard Character set for Optical Character Recognition(OSASCSOCR) 17 -1966.

HANDBOOK FOR KEYBOARD ARRANGEMENTS

IEC 60300-3-6:1997 可信性管理 第3部分:应用指南 第6节:软件可信性

Dependability management - Part 3: Application guide - Section 6: Software aspects of dependability

ANSI/IEC/ASQ D1070:1997 稳态可靠性的符合性试验程序

Specifies techniques for availability performance measures used in either steady-state availability or steady-state unavailability.

Compliance Test Procedures for Steady State Reliability

ANSI/IEC/ASQ D1123:1997 可靠性试验.符合性试验计划的成功率

Specifies procedures for applying and preparing compliance test plans for success ratio or failure ratio.

Reliability Testing - Compliance Test Plans for Success Ratio

BS EN 61709:2000 电子器件.可靠度.失效率的参考条件和转换的应力模型

This International Standard gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this standard then no additional information on the specified conditions is required. The stress models described in this standard should be used as a basis for conversion of the failure rate data at reference conditions to the actual operating conditions. Conversion of failure rate data are only permissible within the specified functional limits of the components (see Annex A).

Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion

IEC 61709:1996 电子元器件 可靠性 失效率和应力模型的基准条件

This International Standard gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this standard then no additional information on the specified conditions is required. The stress models described in this standard should be used as a basis for conversion of the failure rate data at reference conditions to the actual operating conditions. Conversion of failure rate data are only permissible within the specified functional limits of the components (see annex A).

Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion

IEC 60300-3-3:1996 可信性管理 第3部分:应用指南 第3节:寿命周期费用分析

Dependability management - Part 3: Application guide - Section 3: Life cycle costing

IEC 60300-3-4:1996 可信性管理 第3部分:应用指南 第4节:可信性要求规定指南

Gives guidance on specifying required dependability characteristics in product and equipment specifications, together with specifications of procedures and criteria for verification.

Dependability management - Part 3: Application guide - Section 4: Guide to the specification of dependability requirements