L10 电子元件综合 标准查询与下载

JIS R 1661:2004 离子导电精细陶瓷的导电性测量方法

この規格は，イオン輸率が0.99以上のファインセラミックスイオン伝導体の高温における体積ィオン導電率の測定方法について規定する。適用できる導電率の範囲は.1-1000S/mとする。

Method for conductivity measurement of ion-conductive fine ceramics

JIS R 1660-1:2004 毫米波频率范围内精细陶瓷介电性能的测量方法.第1部分:截止波导法

この規格は，主にミリ波回路に用いる低損失誘電体基板用ファインセラミヅクスの遮断円筒導波管方法によるミリ波帯における誘電特性の測定方法について規定する。

Measurement method for dielectric properties of fine ceramics in millimeter wave frequency range -- Part 1: Cutoff waveguide method

JIS R 1660-2:2004 毫米波频率范围内精细陶瓷介电性能的测量方法.第2部分:开启式谐振腔法

この規格は，主にミリ波回路に用いる低損失誘電体基板用フアインセラミックスの，開放形共振器方法によるミリ波帯における誘電特性の測定方法について規定する。

Measurement method for dielectric properties of fine ceramics in millimeter wave frequency range -- Part 2: Open resonator method

JIS R 1660-3:2004 毫米波频率范围内精细陶瓷介电性能的测量方法.第3部分:NRD导向激发的介电谐振器法

この規格は，主にミリ波フィルタ，共振器に用いる低損失誘電体共振器用ファインセラミックス材料のNRDガイド励振誘電体共振器方法によるミリ波帯における誘電特性の測定方法について規定する。

Measurement method for dielectric properties of fine ceramics in millimeter wave frequency range -- Part 3: Dielectric resonator method excited by NRD-guide

ARMY MIL-PRF-39001 D-2004 稳定性能最佳和非性能最佳云母电介体式固定电容器

This specification covers the general requirements for established reliability(ER) and nonestablished reliability(non-ER), mica dielectric, fixed capacitors(see 6.1).

CAPACITORS, FIXED, MICA DIELECTRIC, ESTABLISHED RELIABILITY AND NONESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR

IPC 2581-2004 印制电路板装配产品制造描述数据和传递方法包含通用要求,修正1:2007年5月

This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology Incorporates Amendment 1: 5/2007

IPC 2141A-2004 适用于高速控制阻抗电路板的设计指南

This guide is intended to be used by circuit designers, packaging engineers, printed board fabricators, and procurement personnel so that all may have a common understanding of each other’s area.

Design Guide for High-Speed Controlled Impedance Circuit Boards

DLA MIL-DTL-3965 H-2004 钽(非固体电解)固定电解电容器

This specification covers the general requirements for tantalum, electrolytic (nonsolid electrolyte), fixed capacitors (polarized and nonpolarized), hermetically and nonhermetically sealed (see 1.2.1.7) in metal cases; style CL67 and all tubular-foil styles are insulated (see 6.1). This specification also covers removable counting brackets for use with the CL55-series capacitors.

CAPACITOR, FIXED ELECTROLYTIC (NONSOLID ELECTROLYTE), TANTALUM, GENERAL SPECIFICATION FOR

DLA MIL-C-62 E SUPP 1-2004 电容器,固定的,电解质(DC,铝制,干电解质,极化)通用规格

This supplement forms a part of MIL-C-62E, dated 2 February 2004

CAPACITORS, FIXED, ELECTROLYTIC (DC, ALUMINIM, DRY ELECTROLYTE, POLARIZED), GENERAL SPECIFICATION FOR

DLA MIL-C-62 E-2004 电容器,固定的,电解质(DC,铝制,干电解质,极化)通用规格

This specification covers the general requirements for polarized, dry-electrolyte, aluminum, direct current (dc), fixed capacitors for use in filter and bypass circuits where large excesses of capacitance over the nominal capacitance can be tolerated.

CAPACITORS, FIXED, ELECTROLYTIC (DC, ALUMINIM, DRY ELECTROLYTE, POLARIZED), GENERAL SPECIFICATION FOR

DLA MIL-C-25 E-2004 电容器,固定的,纸质和塑胶介质,直流电(在金属箱内密封)通用规格[使用 代替: DLA MIL-C-0025 B(1)]

This specification covers the general requirements for direct current (dc) paper-dielectric, fixed capacitors hermetically sealed in metal cases, intended primarily for filter, by-pass, and blocking purposes where the alternating-current (ac) component of the impressed voltage is small with respect to the dc voltage rating.

CAPACITORS, FIXED, PAPER OR PLASTIC DIELECTRIC, DIRECT CURRENT, (HERMETICALLY SEALED IN METAL CASES), GENERAL SPECIFICATION FOR [Use In Lieu Of: DLA MIL-C-0025 B (1)]

IPC CM-770E-2004 印制电路板组件安装准则

This document provides information for preparation of components for assembly to printed boards, contains a review of some pertinent design criteria, impacts and issues, techniques of general interest for assembly (both manual and machines) and discusses considerations of, and impacts upon, subsequent soldering, cleaning, and coating processes. The information herein consists of compiled data representing commercial and industrial applications.

Guidelines for Printed Board Component Mounting

UL 207 BULLETINS-2004 非电气包含非电气制冷元件和附件用第7版标准的基本原理和提议要求、UL 207

This bulletin proposes the following: 1. Clarifying the discharge pressure requirement for pressure relief valves. 2. Revising the Rupture Member Test with respect to the nominal burst pressure. 3. Revising the Manufacturing and Production Tests section to clarify the necessary production line leakage and hydrostatic strength tests on low side components. 4. Revising markings for clarification purposes.

RATIONALE AND PROPOSED REQUIREMENTS FOR THE SEVENTH EDITION OF THE STANDARD FOR REFRIGERANT-CONTAINING COMPONENTS AND ACCESSORIES, NONELECTRICAL, UL 207

IPC 7912A-2004 印刷电路板组件最终产品

This document is intended to define standard methods for the categorization of defects related to electronic printed board assemblies (PBAs). This document will provide consistent methodologies for calculating the following benchmark indices:

End-Item DPMO for Printed Circuit Board Assemblies

DLA DSCC-DWG-88012 REV D-2004 固定敷金属聚四氟乙烯介质密封的电容器

This drawing and MIL-PRF-83421 describes the requirements for PTFE (Teflon) dielectric capacitors.

CAPACITORS, FIXED, METALLIZED PTFE (TEFLON) DIELECTRIC, HERMTICALLY SEALED

DLA DSCC-DWG-87112 REV G-2004 电容器,陶瓷制,单行排齐封装,网络,(电容器区7)BX

This drawing, MIL-PRF-39014, and MIL-PRF-39014/5 describe the complete requirements for single-in-line packaged multilayer ceramic capacitor networks.

CAPACITORS, CERAMIC, SINGLE IN-LINE PACKAGE, NETWORK, (7 CAPACITOR SECTIONS) BX

DLA DSCC-DWG-87119 REV G-2004 电容器,陶瓷制,单行排齐封装,网络,(电容器区8)BX

The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed

CAPACITORS, CERAMIC, SINGLE IN-LINE PACKAGE, NETWORK, (8 CAPACITOR SECTIONS) BX

DLA DSCC-DWG-87120 REV G-2004 电容器,陶瓷制,单行排齐封装,网络,(电容器区8)CG

This drawing and MIL-PRF-20 describe the complete requirements for single-in-line packaged multilayer ceramic capacitor networks.

CAPACITORS, CERAMIC, SINGLE IN-LINE PACKAGE, NETWORK, (8 CAPACITOR SECTIONS) CG

DLA DSCC-DWG-87122 REV G-2004 电容器,陶瓷制,单行排齐封装,网络,(电容器区4)BX

This drawing, MIL-PRF-39014, and MIL-PRF-39014/5 describe the complete requirements for single-in-line packaged multilayer ceramic capacitor networks.

CAPACITORS, CERAMIC, SINGLE IN-LINE PACKAGE, NETWORK, (4 CAPACITOR SECTIONS) BX

ASTM F677-04 电子和微电子学应用的热固性密封胶的耐流体和滑脂性能的标准试验方法

Fluids and greases in contact with encapsulating compounds may adversely modify the encapsulant properties with resulting damage or loss of protection to components in electronic applications. This test method provides a means for measuring the effect of fluids and greases on various encapsulants. This test method is intended for use in research and evaluation.1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 0) and volume under defined conditions of time and temperature. Note 0To provide consistency with the usage in other ASTM test methods concerned with determining the properties of plastic materials, the terms "weight" and "weigh" are used in this test method although the units of measurement are those of mass.1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 9.1. 1.3 The values stated in SI units are standard. The values in parentheses are for information only.Note 2There is no similar or equivalent IEC standard.

Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications