L10 电子元件综合 标准查询与下载

JEDEC JESD62-A-2002 电子元件的外部鉴定和管理系统

Component quality and reliability can be improved by the implementation of an Outlier Identification and Management system (OIMS) that utilizes a statistical method of identifying and potentially removing parts with electrically abnormal characteristics (outliers), with the goal of fine-tuning manufacturing processes and minimizing the probability of customer impact. An OIMS program can be implemented across an entire spectrum of processes including, but not limited to, fabrication, assembly, test, packaging, and handling operations.

Outlier Identification and Management System for Electronic Components

DLA SMD-5962-88663 REV A-2002 硅单片8位D/A转换器电压模式八进制数线性微电路

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

MICROCIRCUIT, LINEAR, OCTAL, VOLTAGE MODE, 8-BIT D/A CONVERTER, MONOLITHIC SILICON

DLA DSCC-DWG-87113 REV B-2002 编码轮转筒

Dimensions are in millimeters.

DRUM, CODE WHEEL

DLA SMD-5962-88659 REV B-2002 硅单片微处理器兼容12位电压输出D/A转换器线性微电路

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

MICROCIRCUIT, LINEAR, 12-BIT VOLTAGE OUTPUT D/A CONVERTER, MICROPROCESSOR COMPATIBLE, MONOLITHIC SILICON

ECA SP4973-2002 用于电子设备的生产球栅阵列(BGA),低接脚数(不多于1088针)插座的详细规范.评论截止日期2002年4月11日 EIA-540BOAB

This specification covers interconnect systems typically used for production ball grid array (BGA) devices with pin counts of 1088 and less.

Proposed New Specification Detail Specification for Production Ball Grid Array (BGA), Low Pin Count (1088 Pins and Less) Socket for Use in Electronic Equipment Comment Period Expires: April 11, 2002; Proposed Document Number EIA-540BOAB

SJ 51065/7-2002 GTP004A、GTP023A、GTP029A型普通同轴射频隔离器详细规范

GTP004A、GTP023A、GTP029A type ordinary coaxial radio-frequency isolator detail specification for

IPC 2547-2002 印刷电路板的测试,检验和返修车间设备通信信息(CAMX)分段要求

Factory Information Systems (FIS) form the nervous system of an enterprise, analyzing data and delivering information to the machines and people who need to make information-based decisions. These systems provide a bi-directional flow of information between the factory floor and the rest of the enterprise and beyond.

Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Rework

ASTM F542-02 电子元件及微电子元件封装用密封化合物发热温度的标准试验方法

1.1 This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.1.2 This test method provides a means to measure the peak exothermic temperature of an encapsulating compound.1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8.Note 18212;There is no equivalent IEC standard.

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

IPC 4552-2002 印刷电路板化学镀镍/浸金(ENIG)镀规格

This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM).

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

IPC D-356B-2002 裸露基板电气测试数据格式

This standard describes a data format for transmitting bare board electrical test information. The material contained herein is intended to convey requirements, guidelines, and examples necessary to provide the data structures and concepts for bare board electrical test information in digital form, including data suitable for computer aided repair. When used as a netlist input to test data processing, the receiver of IPC-D-356B data will determine test point assignments and positioning.

Bare Substrate Electrical Test Data Format

ANSI/AGMA 9009-D-2002 柔性耦合件.柔性耦合件术语

Presents the nomenclature common to flexible couplings as used in mechanical power transmission drives. It was prepared to reduce the language barriers that arise between designers, manufacturers, and users when attempting to designate various types of flexible couplngs and their elements. It does not address nomenclature for flexible shafts, quill shafts, universal joints or devices which exhibit slip such as clutches, fluid couplings, magnetic couplings or torque converters.

Flexible Couplings - Nomenclature of Flexible Couplings

KS C 6384-181-2001 电子设备用固定电容器.第18部分:空白详细规范:固体(MnO2)电解质片式铝固定电容器评定水平E

개별 규격 지침 개별 규격 지침은 품종 규격을 보충하는 문서이며, 개별 규격의 모양, 배

Fixed capacitors for use in electronic equipment-Part 18: Blank detail specification:Fixed aluminium electrolytic chip capacitors with solid(MnO2) electrolyte. Assessment level E

KS C 6384-18-2001 电子设备用固定电容器.第18部分:分规范:固体(MnO2)与非固体电解质片式铝固定电容器

이 규격은 고체(MnO2) 및 비고체 전해질을 갖는 고정 알루미늄 전해 칩 커패시터에 적용

Fixed capacitors for use in electronic equipment－Part 18： Sectional specification：Fixed aluminium electrolytic chip capacitors with solid(MnO2) and non-solid electrolyte

NF C93-476-3:2001 电子设备的机械结构.室外外壳.第3部分:分规范.壳体和外壳的气候、机械试验和安全性诸方面

Mechanical structures for electronic equipment - Outdoor enclosures - Part 3 : sectional specification - Climatic, mechanical tests and safety aspects for cabinets and cases.

KS C 6384-11-2001 电子设备用固定电容器.第11部分:分规范:金属箔式聚乙烯对苯二甲酸乙二醇酯膜介质直流固定电容器(可供认证用)

이 규격은 폴리에틸렌 필름을 유전체로 하고 금속박 전극을 갖는 직류용 고정 커패시터에 적용

Fixed capacitors for use in electronic equipment－Part 11：Sectional specification：Fixed polyethylene-terephthalate film dielectric meta foil d.c. capacitors

KS C 6384-121-2001 电子设备用固定电容器.第12部分:空白详细规范:金属化聚碳酸酯膜介质直流固定电容器评定水平E

개별 규격 지침 개별 규격 지침은 품종 규격을 보충하는 문서이며, 개별 규격의 모양, 배

Fixed capacitors for use in electronic equipment-Part 12:Blank detail specification:Fixed polycarbonatefilm dielectric metal foil d.c. capacitors. Assessment level E

KS C 6384-10-2001 电子设备用固定电容器.第10部分:分规范:多层片式瓷介电容器

이 규격은 정격 전압 200V 이하인 전자 기기에 사용되는 종류 1과 종류 2의 고정 비외

Fixed capacitors for use in electronic equipment-Part 10:Sectional specification:Fixed multilayer ceramic chip capacitors

KS C 6384-13-2001 电子设备用固定电容器.第13部分:分规范:聚碳酸酯膜介质直流固定电容器

이 규격은 폴리프로필렌 필름을 유전체로 하고 금속박 전극을 가진 직류용 고정 커패시터에 적

Fixed capacitors for use in electronic equipment－Part 13：Sectional specification：Fixed polypropylene filmdielectric metal foil d.c. capacitors

KS C 6384-101-2001 电子设备用固定电容器.第10部分:空白详细规范:多层片式瓷介电容器.评定水平E

개별 규격 지침 개별 규격 지침은 품종 규격을 보충하는 문서이며, 개별 규격의 모양, 배

Fixed capacitors for use in electronic equipment-Part 10:Blank detail specification:Fixed multilayerceramic chip capacitors. Assessment level E

KS C 6384-12-2001 电子设备用固定电容器.第12部分:分规范:金属化聚碳酸酯膜介质直流固定电容器

이 규격은 폴리카보네이트 필름을 유전체로 하고 금속박 전극을 갖는 직류용 고정 커패시터에

Fixed capacitors for use in electronic equipment-Part 12:Sectional specification:Fixed polycarbonate film dielectric metal foil d.c. capacitors