L30 印制电路 标准查询与下载

BS EN 61249-2-30:2013 印制板和其它互连结构用材料.第2-30部分:包被和非包被增强基材.规定了易燃性包铜的非卤代环氧改良氰酸酯玻璃纤维层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

SN/T 3480.1-2013 进出口电子电工工业成套设备检验技术要求.第 1部分：印刷线路板表面贴装设备

SN/T 3480的本部分规定了进出口电子电工工业成套设备之成套印刷线路板表面贴装设备(以下简称成套PCB表面贴装设备)的检验技术要求。本部分适用于3.1所定义、附录A所列举的成套PCB表面贴装设备的组成单元设备(含国家允许进口的旧成套PCB表面贴装设备)的检验。

Technical requirements for the inspection of complete set of equipment in electronic and electrical industry for import and export.Part 1:PCB surfaced mounting equipment

ANSI/UL 796a-2013 印制线路板的安全性标准

Standard for Safety for Printed-Wiring Boards

ANSI/UL 796-2013 印制线路板的安全性标准

Standard for Safety for Printed-Wiring Boards

ANSI/ASTM D1867:2013 印制电路用镀铜热固层压板的规范

Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

IEC 91/1081/CD:2013 IEC/TS 62326-16, Ed1 印刷电路板 第16部分 设备嵌入式衬底技术 通用术语

IEC/TS 62326-16, Ed. 1: Printed boards - Part 16: Device Embedded Substrate Technology - Generics

IEC 61193-3:2013 质量评定体系.第3部分:印刷电路板和层板制成品和过程产品检验用抽样方案的选择和使用

This part of IEC 61193 establishes sampling plans for inspection by attributes@ including sample plan selection criteria and implementation procedures for printed board and laminate end-product and in-process auditing. The principles established herein permit the use of different sampling plans that may be applied to an individual attribute or set of attributes@ according to classification of importance with regard to form@ fit and function.

Quality assessment systems - Part 3: Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing

IEC 91/1082/CD:2013 IEC/TS 62326-17, Ed. 1:印刷电路板.第17部分:装置嵌入基体.TEG(测试元件组)

IEC/TS 62326-17, Ed. 1: Printed boards - Part 17: Device embedded substrates - TEG (test element group)

IEC 91/1084/CD:2013 IEC/TS 62326-16, Ed. 1:印刷电路板.第19部分:设备嵌入式衬底.设计指南

IEC/TS 62326-19, Ed. 1: Printed boards - Part 19: Device Embedded Substrate - Design Guide

ASTM D1867-13 印制电路用镀铜热固层压板的标准规格

1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. 1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

KS C IEC 61249-3-1:2012 印制电路板和其他互连结构用材料.第3-1部分:挠性板用覆铜层压板(黏着型及非黏着型)

이 표준은 접착형 및 비접착형 연성 기판에 사용되는 동박 적층판의 특성을 명시한다.

Materials for printed boards and other interconnecting structures－Part 3-1：Copper-clad laminates for flexible boards (Adhesive and non-adhesive types)

KS C IEC 62326-14:2012 印刷电路板.第14部分:设备嵌入式基板.术语/可靠性/设计指导

이 표준은 비아, 도체도금, 전도성 페이스트, 인쇄 등의 방법을 통해 전자적으로 연결된 기

Printed boards－Part 14：Device embedded substrate－Terminology/reliability/design guide

KS C IEC 61249-4-1:2012 印刷电路板和其他互连结构用材料.第4-1部分:(多层电路板的生产用)的部分预浸料标准.规定的阻燃等级的E.玻璃纤维编织环氧树脂预浸胶带

이 표준은 프리프레그 특성의 요구 조건을 수록하고 있다. 프리프레그는 KS C IEC 62

Materials for printed boards and other interconnecting structures－Part 4-1：Sectional specification set for prepreg materials, unclad(for the manufacture of multilayer boards)－Epoxide woven E-glass prepreg of defined flammability

KS C IEC 61188-7:2012 印刷电路板和印刷电路板组件.设计与应用.第7部分:CAD库建立电子元件、确认的起源

이 표준은 전자부품 원점에 대한 서술 및 랜드패턴 구조에 대한 기술을 다룬다. 이 표준은

Printed boards and printed board assemblies－Design and use－Part 7：Electronic component zero orientation for CAD library construction

DB35/T 1293-2012 无铅焊接用覆铜箔环氧玻纤布层压板

本标准规定了无铅焊接用覆铜箔环氧玻纤布层压板的术语和定义、型号、要求、试验方法、检验规则及标志、包装、运输和贮存。 本标准适用于玻璃纤维布浸以环氧树脂、表面覆铜箔、经热压而成的适合于无铅焊接工艺的覆铜箔 层压板（以下简称覆箔板）。

Copper clad epoxy fiberglass cloth laminate for lead-free soldering

IEC 61249-2-39:2012 印制板和其它互连结构用材料.第2-39部分:包被和非包被增强基材.无铅组件用规定了易燃性的包铜高性能环氧和非环氧编织E型玻璃纤维增强层压板(垂直燃烧试验)

This part of IEC 61249 specifies requirements for properties of modified brominated epoxide woven E-glass laminated sheet of a thickness 0@05 mm up to 3@2 mm@ of defined flammability (vertical burning test)@ copper-clad. The glass transition temperature is defined to be 170 ??minimum. Its flame resistance is defined in terms of the flammability requirements of 7.3. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order@ otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-30:2012 印制板和其它互连结构用材料.第2-30部分:包被和非包被增强基材.规定的易燃性包铜的非卤代环氧改良氰酸酯玻璃纤维层压板(垂直燃烧试验)

This part of IEC 61249 gives requirements for properties of non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test)@ copper-clad in thicknesses of 0@03 mm up to 1@60 mm. The flammability rating is achieved through the use of non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire retardants are contained as part of polymeric structure or in addition to it. The glass transition temperature is defined to be 160 ??minimum. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order@ otherwise the default class of material may be supplied.

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

IEC 61249-2-40:2012 印制板和其它互连结构用材料.第2-40部分:包被和非包被增强基材.规定了易燃性的高性能非卤代环氧编织E型玻璃纤维增强层压板(垂直燃烧试验)

This part of IEC 61249 specifies requirements for properties of modified non-halogenated epoxide woven E-glass laminated sheet of a thickness of 0@05 mm up to 3@2 mm@ of defined flammability (vertical burning test)@ copper-clad. The glass transition temperature is defined to be 170 ??minimum. Its flame resistance is defined in terms of the flammability requirements of 7.3. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order@ otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non- halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-cl

IEC 61249-2-27:2012 印制板和其它互连结构用材料.第2-27部分:包被和非包被增强基材.规定了易燃性的双马来酰亚胺/三嗪改良型非卤代环氧编织玻璃纤维层压板(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning te

BS EN 61182-2-2:2012 印刷电路板组装产品. 制造描述数据和传输方法. 印刷电路板制造数据描述实施的分要求

Printed board assembly products. Manufacturing description data and transfer methodology. Sectional requirements for implementation of printed board fabrication data description