L30 印制电路 标准查询与下载

BS PD IEC/PAS 61249-8-5:2014 永久焊接面罩和柔性覆盖材料的性能规格和合格鉴定

Qualification and performance specification of permanent solder mask and flexible cover materials

BS PD IEC/PAS 61249-8-1:2014 印制板组装电气绝缘性能和质量手册

Qualification and performance of electrical insulating compound for printed wiring assemblies

BS PD IEC/TR 62866:2014 印刷电路板和组件的电化学迁移. 机制和试验

Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

NF C90-704:2014 印刷电路板组件. 第2部分: 分规范. 表面安装焊接组件的要求

La présente partie de la CEI 61191 donne les exigences relatives aux connexions brasées pour montage en surface. Les exigences se rapportent aux ensembles intégrant uniquement le montage en surface ou aux portions d'ensembles pour montage en surface incluant d'autres technologies associées (par exemple montage par trous traversants, montage à puce, à borne, etc.).

Printed board assemblies - Part 2 : sectional specification - Requirements for surface mount soldered assemblies

DB44/T 1350-2014 高速电路用覆铜箔层压板技术规范

本标准规定了高速电路用覆铜箔层压板的相关术语、分类、型号及标识、要求、试验方法、检验规则、包装、标志、运输和贮存等要求。 本标准适用于高速电路用覆铜箔层压板（以下简称高速覆铜板）。

Technical specification for copper clad laminates for high speed circuits

DIN EN 62496-2-4:2014 光学电路板. 基本试验和测量程序. 第2-4部分:不带输入/输出纤维光电路板的光传输试验 (IEC 62496-2-4-2013); 德文版本EN 62496-2-4-2013

Optical circuit boards - Basic test and measurement procedures - Part 2-4: Optical transmission test for optical circuit boards without input/output fibres (IEC 62496-2-4:2013); German version EN 62496-2-4:2013

DIN IEC/TR 62878-2-2:2014 设备嵌入式基质.指南.电气测试(IEC 91/1138A/CD-2013)

Device embedded substrate - Guidelines - Electrical testing (IEC 91/1138A/CD:2013)

NF C90-703:2014 印刷电路板组件. 第1部分: 总规格. 使用表面安装和相关装配技术的焊接电气和电子组件的要求

La présente partie de la CEI 61191 établit les exigences relatives aux matériaux, méthodes et critères de vérification utilisés dans le cadre de la production d'interconnexions et d'ensembles brasés de qualité faisant appel à la technique de montage en surface ainsi qu'à des techniques de montage associées. La présente partie de la CEI 61191 comprend également des recommandations concernant la qualité des processus de fabrication.

Printed board assemblies - Part 1 : generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

BS EN 61249-4-19:2013 印制板和其它互连结构用材料. 未包覆预浸料的分规范集 (用于多层板制造). 无铅组件用确定易燃性的非卤代环氧化物编织的E玻璃预浸渍材料 (垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability

BS EN 61249-4-18:2013 印制板和其它互连结构用材料. 未包覆预浸料的分规范集 (用于多层板制造). 无铅组件用确定易燃性的环氧化物编织的E玻璃预浸渍材料 (垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burnin

BS EN 61249-4-19:2014 印制板和其它互连结构用材料. 未包覆预浸料的分规范集 (用于多层板制造). 无铅组件用确定易燃性的非卤代环氧化物编织的E玻璃预浸渍材料 (垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability

BS EN 61249-4-18:2014 印制板和其它互连结构用材料. 未包覆预浸料的分规范集 (用于多层板制造). 无铅组件用确定易燃性的环氧化物编织的E玻璃预浸渍材料 (垂直燃烧试验)

Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burnin

DIN EN 61191-2:2014 印刷电路板组件.第2部分:分规范.表面安装焊接组件的要求(IEC 61191-2-2013).德文版本EN 61191-2-2013

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2013); German version EN 61191-2:2013

DIN EN 61191-1:2014 印刷电路板组件. 第1部分: 总规范. 使用表面安装和相关装配技术的焊接电气和电子组件的要求(IEC 61191-1-2013); 德文版本EN 61191-1-2013

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013); German version EN 61191-1:2013

JIS C 61191-1 ERRATUM 1:2014 勘误表

ERRATUM

KS C IEC 60249-2-2:2013 印制电路用基材.第2部分:规范.第2章:经济型酚醛纤维素纸覆铜层压板

Base materials for printed circuits－Part 2：Specifications－ Specification No.2：Phenolic cellulose paper copper－clad laminated sheet, economic quality

DIN EN 61193-3:2013 质量评估体系.第3部分:印刷电路板和层板制成品和过程产品检验用抽样方案的选择和使用(IEC 61193-3-2013).德文版本EN 61193-3-2013

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (IEC 61193-3:2013); German version EN 61193-3:2013

IEC 61249-4-19:2013 印制板和其它互连结构用材料(用于多层板制造).第4-19部分:未包覆预浸料的分规范集.无铅组件用确定可燃性高效非卤代环氧化物编织的E玻璃预浸渍材料

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-40 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions@ the glass transition temperature is defined to be 170 ??minimum.

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non- halogenated epoxide woven E-glass prepreg of define

IEC 61249-4-18:2013 印制板和其它互连结构用材料 第4-18部分 未包覆预浸料的分规范集(用于多层板制造) 无铅组件用确定易燃性的环氧化物编织的E玻璃预浸渍材料(垂直燃烧试验)

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-39 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions@ the glass transition temperature is defined to be 170 ??minimum.

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (v

BS EN 61191-2:2013 印刷电路板组件. 分规范. 表面安装焊接组件的要求

Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies