L30 印制电路 标准查询与下载
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UL Standard for Safety Flexible Materials Interconnect Constructions - Section / Paragraph Reference: Multiple Subject: Printed-Wiring Boards (Edition 2: October 25, 2010)
- ICS
- CCS
- L30
- 发布
- 2012-06-22
- 实施
Optical circuit boards - Part 2-1: Measurements - Optical attenuation and isolation (IEC 62496-2-1:2011); German version EN 62496-2-1:2011
- ICS
- 33.180.99
- CCS
- L30
- 发布
- 2012-06
- 实施
- 2012-06-01
This part of IEC 61182 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details@ defined in the generic standard IEC 61182-2 and some of the sectional standards that are required to accomplish the focused tasks. When other standards are invoked@ their requirements become a mandatory part of the fabrication details as defined in the IEC 61182-2. The IEC 61182-2 contains all the requirements necessary to build an electronic product. The cardinality indicated in the IEC 61182-2 may be superseded by a restriction of an attribute (enumerated string ID) or indication of a requirement that is noted as being optional in the generic standard. However@ this standard renders the requirement mandatory based on the supply chain communication need. In order to assist the users of this standard@ all the applicable XML schema elements that apply to the board fabrication function are listed in Annex A. The list is grouped by topics and shows the absolute path for the elements that pertain to the focus of this standard. If the parent element is not present no children are considered in the implementation either. However@ all attributes identified for a particular element follow the cardinality of the IEC 61182-2@ unless a restriction is stated in this standard.
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-04
- 实施
- 2012-04-30
The following changes to UL 796 are being proposed: 1) Revise requirements for testing conditions described in Paragraph 4.2; 2) Revise the dimensions of thicknesses specified in Table 9.2; 3) Add tolerance for the width of a conductor shown in Figure 10.1; and 4) Delete Section 31.4 (HDI Thermal Cycling).
Standard for Safety for Printed-Wiring Boards
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-01-01
- 实施
The following changes to UL 746F are being proposed: 1) Revision of Requirements for Testing Conditions Described in Paragraph 4.2; 2) Revision of a Requirement for IR Analysis Adhesive Only in Table 8.2; 3) Clarification of Sample Requirements for Bond Strength Test; 4) Addition of Requirements for Evaluating Asymmetrical Construction Samples in Paragraphs 15.5.11 and 16.5.6; 5) Inclusion of a Tolerance for the Dimension of a Conductor in Figure 17.1; and 6) Revision of Requirements for the Repeated Flexing Test.
Standard for Safety for Polymeric Materials - Flexible Dielectric Film Materials for Use in Printed-Wiring Boards and Flexible Materials Interconnect Constructions
- ICS
- 83.140.01
- CCS
- L30
- 发布
- 2012-01-01
- 实施
The following changes to UL 796F are being proposed: 1) Revise requirements for testing conditions described in Paragraph 5.1.5.3; 2) Add tolerance for the width of a conductor shown in Figure 5.6.1; 3) Clarify sample requirements for Bond Strength Test in Paragraphs 5.6.5.2 and 5.6.5.3; 4) Add requirements for evaluating asymmetrical construction samples in Paragraphs 5.9.5.7 and 5.10.5.3; 5) Add tolerance for the width of a conductor shown in Figure 5.11.2; and 6) Add sample requirements for Flammability Tests on conductive paste material in new Section 5.15.2.
Standard for Safety for Flexible Materials Interconnect Constructions
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-01-01
- 实施
To resolve comments received by UL to the following proposal for UL 796F, which was originally published on August 26, 2011: Proposal to Add Sample Requirements for Flammability Tests on Conductive Paste Material in New Section 5.15.2.
Standard for Safety for Flexible Materials Interconnect Constructions
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-01-01
- 实施
IEEE Standard for Boundary-Scan-Based Stimulus of Interconnections to Passive and/or Active Components
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012
- 实施
1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards. 1.2 The procedures appear in the following sections: Procedure Section 8199;Referenced Documents 2 8199;Conditioning 4 8199;Dielectric Breakdown Voltage Parallel to Laminations 13 8199;Dimensional Instability 19 8199;Dissipation Factor 14 8199;Flammability Rating Test 16 8199;Flexural Strength, Flatwise at Elevated Temperature 15 8199;Flexural Strength, Flatwise at Room Temperature 15 8199;Oven Blister Test 17 8199;Peel Strength Test at Elevated Temperature 10 8199;Peel Strength Test at Room Temperature
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
- ICS
- 83.140.20 (Laminated sheets)
- CCS
- L30
- 发布
- 2012
- 实施
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 2. Test methods for materials for interconnection structures
- ICS
- 31.190
- CCS
- L30
- 发布
- 2012
- 实施
- 2013-07-01
Standard for Safety for Flexible Materials Interconnect Constructions
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012
- 实施
本规范规定了军用印制线路板用的覆或不覆金属箔的刚性层压板（以下简称层压板）和半固化的（固化到B阶段）预浸材料（以下简称粘结片）的性能要求、质量保证、采购文件、交货准备和说明事项。 本规范适用于制造各种军用印制电路板的刚性层压板和制造刚性多层印制电路板用的粘结片，不适用于金属基覆铜箔层压板。
General specification for metal-clad laminated sheets for printed wiring boards
- ICS
- CCS
- L30
- 发布
- 2011-12-25
- 实施
- 2012-04-01
Printed board assemblies -- Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-12-20
- 实施
本部分规定了中心机房内固定使用的电信设备在正常使用中（包括安装、停机和维修等）的环境适宜性要求以及环境试验方法。 本部分适用于在正常情况下固定安装在中心机房使用的电信设备（包括传输设备、无线设备等）。不适用于该类设备可能遇到的由火、爆炸、离子辐射及其他意外的偶然事故造成的环境条件，这些另作特殊情况考虑，也不适用于该类设备的贮存、运输过程。
Environmental test requirements and test methods for telecommunications equipment.Part 2:telecommunication equipment in central room
- ICS
- 33.050
- CCS
- L30
- 发布
- 2011-12-20
- 实施
- 2011-12-20
Optical circuit boards - Part 4: Interface standards - General and guidance (IEC 62496-4:2011); German version EN 62496-4:2011
- ICS
- 33.180.99
- CCS
- L30
- 发布
- 2011-12
- 实施
- 2011-12-01
Specification for finished fabric woven from "E" glass for printed boards
- ICS
- 31.180;59.100.10
- CCS
- L30
- 发布
- 2011-11-30
- 实施
- 2011-11-30
Optical circuit boards - Part 3: Performance standards - General and guidance (IEC 62496-3:2011); German version EN 62496-3:2011
- ICS
- CCS
- L30
- 发布
- 2011-09
- 实施
- 2011-09-01
Optical circuit boards - Part 2-2: Measurements - Dimensions of optical circuit boards (IEC 62496-2-2:2011); German version EN 62496-2-2:2011
- ICS
- 33.180.99
- CCS
- L30
- 发布
- 2011-09
- 实施
- 2011-09-01
KS C IEC 61249 시리즈 중 이 표준은 (수직연소시험에서) 규정된 난연성 등급을
Materials for printed boards and other interconnecting structures－Part 2-35：Reinforced base materials, clad and unclad－Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
이 표준은 인쇄회로기판에 대한 성능인증(CA:Capability Approval) 절차를
Printed boards－Part 1：Generic specification
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
