L30 印制电路 标准查询与下载

GB/T 9315-1988 印制电路板外形尺寸系列

本标准规定了通用的单面、双面和多层印制电路板的外形尺寸系列，但不包括在箱柜中使用的插件式印制电路板的外形尺寸，其带插头和不带插头的印制电路板均以最大外形尺寸计算。

Series for printed boards outside dimension

GB/T 4677.16-1988 印制板一般检验方法

本标准规定了印制板的外观检验和尺寸检验。 本标准适用于单面、双面和多层印制板。

General examination method for printed boards

GB/T 5489-1985 印制板制图

本标准规定了自动、半自动和手工方法绘制印制板零件图及印制板组装件装配图（以下简称印制板装配图）图样的规则。 本标准未规定微型电路、微型组件和类似产品图样的绘制规则。

Printed board drawing

GB/T 4825.1-1984 印制板导线局部放电测试方法

本标准适用于测量印制板上印制导线间的局部放电。

Test method for partial discharge of conductors on printed boards

GB/T 4825.2-1984 印制板导线载流量测试方法

本标准适用于测试印制板上印制导线通过不同电流时的温升，以确定印制导线的载流量。 本方法是一个比较法，用以确定印制导线材料、导线横截面、基材和工艺对印制板的温度——直流电流特性的影响，推荐并规定一个标准试样。

Test method for current carrying capacity of conductors on printed boards

GB 4725-1992 印制电路用覆铜箔环氧玻璃布层压板

Copper-clad epoxy glass cloth laminates for printed circuits

GB/T 4677.10-1984 印制板可焊性测试方法

本标准适用于具有或不具有金属化孔的单面或双面印制板、多层印制板的可焊性的测试。

Test method of solderability for printed boards

DIN EN IEC 62878-2-5:2021 设备嵌入组装技术. 第2-5部分: 指南. 设备嵌入基材三维数据格式的实现(IEC 62878-2-5-2019); 德文版本EN IEC 62878-2-5-2019

This part of IEC 62878 specifies requirements based on XML schema that represents the design data format for device embedded substrate (as known as FUJIKO: Fukuoka University JIsso K(C)Onsortium-format in Japan), that is, active and passive devices embedded board whose electrical

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (IEC 62878-2-5:2019); German version EN IEC 62878-2-5:2019

YD/T 2379.1-2019 电信设备环境试验要求和试验方法 第1部分：通用准则

Environmental test requirements and test methods for telecommunications equipment Part 1: General guidelines

DIN EN 61191-4:2018 印刷电路板组件.第4部分:分规范.接线端焊接组件的要求(IEC 61191-4-2017); 德文版本EN 61191-4-2017

This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are totally terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017

IEC 62899-303-1:2018 印刷电子.第303-1部分:设备.辊间印刷.机械尺寸

This part of IEC 62899 defines standard mechanical dimensions (especially related to the web size) of equipment for printed electronics. This document covers web-based printing equipment, but it can be used for sheet-based products.

Printed electronics - Part 303-1: Equipment - Roll-to-roll printing - Mechanical dimensions

IEC 62899-302-2:2018 印刷电子.第302-2部分:设备.喷墨.液滴体积的成像测量

This part of IEC 62899 specifies the method for determining accurate inkjet droplet volume based on images obtained by drop-in-flight measurement systems. It does not apply to imaging systems using interference fringes, such as holography or phase doppler anemometry. This document is not limited to drop-on-demand inkjet systems, but might not be applicable to continuous inkjet or liquid dispensing systems. This document includes a description of the issues concerning such measurements and consideration of the limits to measurement accuracy.

Printed electronics - Part 302-2: Equipment - Inkjet - Imaging-based measurement of droplet volume

SJ/T 11725-2018 印制电路用导热型覆铜箔环氧复合基层压板

Thermal conductive copper-clad epoxy composite base laminate for printed circuits

IEC 61249-2-47:2018 印制板和其他互连结构用材料. 第2-47部分: 覆层和未覆层增强基材. 非卤化环氧化物无纺/机织E-玻璃增强层压板,导热率为2.0w/( m-K ),并具有规定的可燃性(垂直燃烧试验),无铅装配用铜覆层

This part of IEC 61249 gives requirements for properties of non-halogenated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal conductivity is defined to be (2,0 ± 0,30) W/(m-K).

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m-K) and defined flammabil

IEC 61249-2-46:2018 印制板和其他互连结构用材料. 第2 - 46部分:复合和未复合增强基材. 非卤化环氧化物非织造/机织E -玻璃增强层压板,导热率(1.5w / ( m - K ))和规定的可燃性(垂直燃烧试验),无铅装配用覆铜板

This part of IEC 61249 gives requirements for properties of non-halogenated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal Conductivity is defined to be (1,5 ± 0,2) W/(m-K).

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1,5 W/(m-K)) and defined flammab

IEC 61249-2-45:2018 印制板和其他互连结构用材料. 第2 - 45部分:覆层和未覆层增强基材. 非卤化环氧化物无纺/机织E -玻璃增强层压板,导热率为1.0w / (m - K),并具有规定的可燃性(垂直燃烧试验),无铅装配用铜覆层

This part of IEC 61249 gives requirements for properties of non-halogenated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal conductivity is defined to be (1,0 ± 0,15) W/(m-K).

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m-K) and defined flammabil

IEC 60194-2:2017 印制板设计、制造和装配. 词汇. 第2部分:电子技术以及印刷电路板和电子组装技术的常用

This part of IEC 60194 covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies.

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

BS EN 61188-7:2017 印制电路板和印制电路板组件.设计和使用.CAD文库结构的电子元件零定位

Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction

IEC 61191-4:2017 印刷电路板组件 第4部分:分规范 端点焊接组件的要求

This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

IEC 61189-5-503:2017 电气材料, 印制板和其他互连结构和组合装置的试验方法. 第5-503部分: 材料和组合装置的通用试验方法. 电路板导电阳极丝(CAF)试验

This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards